UWZ1H470MCL1GS

The UWZ1H470MCL1GS is a chip‑type aluminum electrolytic capacitor in the Nichicon UWZ series designed for surface‑mount assembly. It provides 47 µF capacitance at 50 V in a compact SMD can package and is targeted at automotive and industrial electronics that require wide temperature operation and robust manufacturing compatibility.

Key value comes from its wide operating temperature range (−55 °C to +105 °C), AEC‑Q200 qualification, RoHS compliance, and compatibility with high‑temperature reflow processes, making it suitable for automated production and long‑life applications.

Key Features

• Capacitance & Voltage — 47 µF rated capacitance at 50 V, with ±20% tolerance, providing predictable energy storage for power decoupling and bulk filtering.
• Wide Temperature Range — Specified for −55 °C to +105 °C operation, supporting designs that must perform across extreme thermal environments.
• AEC‑Q200 Qualified — Series qualification for automotive use; suitable for designs that require components with automotive reliability pedigree.
• High‑temperature Reflow Compatibility — Chip type engineered to withstand 260 °C peak reflow soldering conditions as specified by the series recommendations for automated assembly.
• Long Life at Elevated Temperature — Rated for 1000 hours at 105 °C under rated voltage, supporting long‑duration performance in thermally demanding applications.
• Low Leakage Current — After 2 minutes at rated voltage and 20 °C, leakage current is ≤ 0.01CV or 3 µA (whichever is greater), enabling stable long‑term operation.
• Ripple Current Ratings — 63 mA at 120 Hz and 94.5 mA at 10 kHz, suitable for smoothing and decoupling duties in switching and power supply circuits.
• Surface‑Mount Package — Radial can SMD package with compact footprint: L 7.7 × D 6.3 mm and recommended land size L 6.6 × W 6.6 mm, enabling dense board layouts and automated placement.
• Regulatory Compliance — Compliant with RoHS directive (2011/65/EU and (EU)2015/863), supporting environmental and regulatory requirements.

Typical Applications

• Automotive electronics — Designed for automotive electronic systems where AEC‑Q200 qualification and wide temperature range are required.
• Power supply filtering — Provides bulk capacitance and ripple handling for DC‑DC converters and power rails requiring 47 µF at 50 V.
• Surface‑mount production lines — Chip‑type format compatible with carrier‑tape feeding and automated placement for high‑volume assembly.

Unique Advantages

• Automotive‑grade reliability: AEC‑Q200 qualification demonstrates suitability for automotive system requirements and higher reliability expectations.
• Wide operating temperature: −55 °C to +105 °C rating supports designs exposed to extreme ambient and thermal conditions.
• Reflow process compatibility: Engineered for 260 °C peak reflow, enabling use in modern lead‑free assembly flows without additional handling constraints.
• Compact SMD can: Small footprint (L 7.7 × D 6.3 mm) and defined land pattern simplify layout and enable space‑constrained board designs.
• Long elevated‑temperature life: 1000 hours at 105 °C under rated voltage provides predictable end‑of‑life characteristics for long‑run products.
• Measured electrical performance: Documented leakage current and ripple current values allow engineers to size and specify confidently for power applications.

Why Choose UWZ1H470MCL1GS?

UWZ1H470MCL1GS combines a compact surface‑mount aluminum electrolytic form factor with automotive‑grade qualification and broad temperature capability. Its 47 µF/50 V rating, documented ripple and leakage characteristics, and 1000‑hour endurance at 105 °C make it a practical choice for engineers specifying capacitors for demanding automotive and industrial power domains.

This part is well suited to customers needing a reliable, manufacturable SMD electrolytic solution that integrates into automated assembly lines and meets RoHS and AEC‑Q200 expectations, helping to reduce qualification effort and support long‑term program stability.

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