UWZ1H2R2MCL1GB
| Part Description |
2.2 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,047 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWZ |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 2.2 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.5 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 16.5 mA @ 10 kHz | Ripple Current Low Frequency | 11 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 4 mm | Surface Mount Land Size | 4.3 x 4.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UWZ1H2R2MCL1GB – Aluminum Electrolytic SMD, 50 V, 2.2 µF
The UWZ1H2R2MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon’s UWZ series designed for surface-mount assembly. This part provides 2.2 µF capacitance at a 50 V rating in a compact radial can SMD package (L: 5.4 × D: 4 mm) and is polarized for standard electrolytic use.
Engineered for demanding temperature and production requirements, the UWZ1H2R2MCL1GB supports a wide operating range (−55 to +105°C), is compatible with 260°C peak reflow processes, and is AEC-Q200 qualified and RoHS compliant—making it suitable for automotive electronic applications and automated surface-mount production.
Key Features
- Capacitance & Voltage — 2.2 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance at 120 Hz, 20°C.
- Package & Mounting — Chip-type radial can SMD package sized L: 5.4 × D: 4 mm with a recommended surface-mount land size of L: 4.3 × W: 4.3 mm; designed for automatic mounting machine feed with carrier tape.
- Wide Temperature Operation — Rated for −55°C to +105°C operation, supporting harsh ambient conditions.
- High-temperature Reflow Compatibility — Compatible with 260°C peak reflow soldering (recommended: 260°C peak for 5 s; see series reflow guidance for cycle specifics).
- AEC-Q200 Qualified & RoHS Compliant — Meets AEC-Q200 qualification for automotive-grade use and complies with RoHS (2011/65/EU, (EU)2015/863).
- Endurance & Reliability — Rated for 1000 hours at 105°C with specified limits on capacitance change, tan δ, and leakage current after recovery to 20°C.
- Leakage & Loss Characteristics — Leakage current limited to 0.01CV or 3 µA (whichever is greater) after 2 minutes at 20°C; tan δ (max) at 50 V is 0.14 (measured at 120 Hz, 20°C).
- Low-frequency & High-frequency Ripple Current — Specified ripple current: 11 mA at 120 Hz and 16.5 mA at 10 kHz.
- Low-temperature Impedance Stability — Impedance ratios: Z(−25°C)/Z(+20°C) = 2 and Z(−40°C)/Z(+20°C) = 3 for the 50 V rating (measurement at 120 Hz).
Typical Applications
- Automotive electronic modules — Provides decoupling and smoothing on 50 V rails in control modules where AEC-Q200 qualification and wide temperature operation are required.
- Power supply filtering in harsh environments — Suitable for filtering and bypass in systems operating from −55°C to +105°C and exposed to standard reflow assembly processes.
- Automated surface-mount production — Designed for pick-and-place and carrier-tape feeding, easing integration into high-volume manufacturing.
Unique Advantages
- Automotive-grade qualification: AEC-Q200 qualification supports use in automotive electronics and other high-reliability applications.
- 260°C reflow compatibility: Supports high-temperature reflow processes for robust solder joints and modern assembly flows.
- Wide operating temperature: −55°C to +105°C rating enables use across a broad range of environmental conditions.
- Measured electrical characteristics: Specified leakage current limits, tan δ, and ripple current figures allow predictable performance in design margin calculations.
- Compact SMD footprint: Small L × D footprint and defined land pattern simplify board layout for dense designs.
- Proven endurance: 1000 hours at 105°C endurance rating supports long-term reliability planning.
Why Choose UWZ1H2R2MCL1GB?
The UWZ1H2R2MCL1GB combines a compact SMD aluminum electrolytic form factor with automotive-grade qualifications and clear, measured electrical specifications. Its 50 V rating, controlled leakage and loss characteristics, and specified ripple currents make it suitable for designers needing predictable decoupling and filtering behavior across wide temperatures.
This part is well suited to engineers and procurement teams building automotive and other high-reliability systems that require AEC-Q200 qualification, RoHS compliance, and compatibility with automated surface-mount assembly. Its series-level endurance and reflow compatibility help reduce integration risk and support consistent manufacturing outcomes.
Request a quote or contact sales to check availability, pricing, and lead-time information for UWZ1H2R2MCL1GB.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016