UWZ1H220MCL1GS

The UWZ1H220MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UWZ series, specified at 22 µF and 50 V. It is a surface-mount, polarized capacitor designed for wide temperature operation (−55 °C to +105 °C) and production processes that require high-temperature soldering.

Key value propositions include AEC-Q200 qualification, compliance with RoHS (2011/65/EU.(EU)2015/863), compatibility with 260 °C peak reflow, and a compact 6.2 × 8 mm package footprint—making it suitable for automotive and other demanding electronics assemblies.

Key Features

• Capacitance & Voltage — 22 µF rated capacitance with a 50 V rated voltage and ±20% tolerance at 120 Hz, 20 °C.
• Wide Temperature Range — Specified operation from −55 °C to +105 °C, enabling use across broad thermal environments.
• High-temperature Reflow Compatibility — Designed to withstand 260 °C peak reflow soldering (recommended: 260 °C peak 5 s; 230 °C over 60 s), supporting lead‑free assembly processes.
• Automotive-grade Reliability — AEC‑Q200 qualified and rated for 1000 hours at 105 °C, with endurance criteria for capacitance, tan δ, and leakage current after the endurance test.
• Compact SMD Package — Chip-style, surface-mount can (radial, can - SMD) with dimensions L: 6.2 × D: 8 mm and recommended land size 8.3 × 8.3 mm for automated placement.
• Performance Parameters — Leakage current specification of not more than 0.01CV or 3 µA (whichever is greater) after 2 minutes at 20 °C; ripple current ratings of 51 mA at 120 Hz and 76.5 mA at 10 kHz.
• Manufacturing & Compliance — Suitable for automatic mounting machines fed with carrier tape and compliant to RoHS (2011/65/EU.(EU)2015/863).

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and −55 °C to +105 °C operation make it appropriate for electronic control modules and other automotive assemblies that require qualified components.
• Automated Surface-mount Production — Chip-style SMD package and carrier-tape feed compatibility support high-volume pick-and-place and reflow assembly lines.
• High-temperature Assembly Processes — Compatibility with 260 °C peak reflow enables use in lead‑free manufacturing flows where elevated soldering temperatures are required.

Unique Advantages

• AEC‑Q200 Qualification: Delivers recognized automotive-grade reliability for designs that require component-level qualification.
• 260 °C Reflow Compatibility: Supports modern lead‑free assembly processes without compromising capacitor characteristics after soldering.
• Wide Operating Temperature: −55 °C to +105 °C rating helps maintain capacitance and electrical performance across harsh thermal environments.
• Proven Endurance: Rated for 1000 hours at 105 °C with specified limits on capacitance change, tan δ, and leakage current—supporting long-term performance verification.
• Compact, Assembly-friendly Package: Small 6.2 × 8 mm footprint and specified surface-mount land size simplify board layout and automated placement.
• Measured Ripple Performance: Specified ripple current values at 120 Hz and 10 kHz enable designers to assess suitability for power-filtering and decoupling needs.

Why Choose UWZ1H220MCL1GS?

The UWZ1H220MCL1GS combines automotive-grade qualification, wide temperature capability, and high-temperature reflow compatibility in a compact surface-mount chip package. Its 22 µF/50 V rating, endurance at 105 °C, and measured ripple current specifications provide design-level transparency for engineers targeting robust, production-ready assemblies.

This part is appropriate for engineers and procurement teams specifying qualified capacitors for automotive electronics and other applications that demand reliable performance through high-temperature assembly and extended thermal exposure. Its RoHS compliance and carrier‑tape assembly compatibility help streamline manufacturing and regulatory requirements.

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