UWZ1H100MCL1GB

The UWZ1H100MCL1GB is a chip-type aluminum electrolytic capacitor in the UWZ series designed for surface-mount applications. It delivers 10 µF at 50 V in a compact radial can SMD package with a wide operating temperature range and reflow-compatible construction.

Targeted for demanding environments, the part carries AEC-Q200 qualification and RoHS compliance, supports automatic placement from carrier tape, and is specified for endurance at elevated temperature for reliable long-term operation.

Key Features

• Electrical — 10 µF capacitance rated at 50 V with polarization and ±20% capacitance tolerance at 120 Hz, 20°C.
• Thermal and Reflow — Designed to correspond with 260°C peak reflow soldering. Recommended reflow condition: 260°C peak for 5 seconds; 230°C over 60 seconds two times (φ8 × 6.2, φ10 × 10 : 1 time).
• Wide Operating Range — Specified for operation from –55°C to +105°C, suitable for high-temperature ambient conditions.
• Reliability / Endurance — Endurance specified as 1000 hours at 105°C with rated voltage applied; for rated voltages of 20 V or more (including 50 V) capacitance change is within ±20% after the test.
• Low-Temperature Performance — Low-temperature impedance stability shown in datasheet tables (for 50 V: Z(–25°C)/Z(+20°C) = 2 max, Z(–40°C)/Z(+20°C) = 3 max).
• Loss and Leakage — tan δ max 0.14 at 50 V (measured at 120 Hz, 20°C). Leakage current: after 2 minutes’ application of rated voltage at 20°C, not more than 0.01CV or 3 µA, whichever is greater.
• Ripple Current — 30 mA at 120 Hz and 45 mA at 10 kHz as specified for the part.
• Package & Mounting — Chip-type radial can SMD package (L: 5.4 × D: 6.3 mm) with recommended PCB land size L: 6.6 × W: 6.6 mm; applicable to automatic mounting machines fed with carrier tape.
• Standards & Compliance — AEC-Q200 qualified and compliant to the RoHS directive (2011/65/EU.(EU)2015/863).

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and –55°C to +105°C operation make this capacitor suitable for automotive electronic modules requiring qualified components.
• Automated Surface-Mount Production — Carrier-tape compatibility and 260°C peak reflow capability enable integration into automated SMT assembly flows.
• High-Temperature Assemblies — Specified endurance at 105°C and soldering-heat resistance support use in assemblies exposed to elevated processing or operating temperatures.

Unique Advantages

• Qualified for Automotive Use: AEC-Q200 qualification provides a documented reliability baseline for safety- and mission-critical electronic designs.
• High-Temperature Reflow Compatibility: Rated for 260°C peak reflow with recommended profiles, simplifying assembly for boards that require high-temperature solder processes.
• Compact SMD Can Package: Small footprint (5.4 × 6.3 mm body) and carrier-tape mounting reduce board space and streamline pick-and-place handling.
• Proven Endurance: 1000 hours at 105°C with defined limits on capacitance change and leakage ensures predictable life performance under thermal stress.
• measurable AC Performance: Specified ripple currents at 120 Hz and 10 kHz plus documented tan δ and low-temperature impedance ratios allow engineers to size and model the capacitor precisely.

Why Choose UWZ1H100MCL1GB?

The UWZ1H100MCL1GB balances compact SMD packaging with high-temperature and qualified reliability characteristics, making it a practical choice where space, assembly robustness, and documented performance matter. Its 50 V rating, defined ripple currents, and endurance data provide the engineering detail required for system-level design and validation.

This part is well suited to designers and procurement teams specifying components for automotive-grade or high-temperature assembly environments who need clear datasheet-backed specifications and automated assembly compatibility.

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