UWZ1H221MCL1GS

The UWZ1H221MCL1GS is a chip-type aluminum electrolytic capacitor in a surface-mount radial can package designed for robust electronic assemblies. It provides 220 µF capacitance at a 50 V rating with ±20% tolerance, and is suitable for automated board-level mounting.

Engineered for demanding thermal and reliability requirements, this part supports 260°C peak reflow processes, operates across a wide temperature range (−55°C to +105°C), and carries AEC-Q200 qualification and RoHS compliance for regulated environments.

Key Features

• Package & Mounting Chip-type aluminum electrolytic in a radial can SMD package; applicable to automatic mounting machines fed with carrier tape and specified surface-mount land size of 1.03 × 1.03 cm.
• Capacitance & Voltage 220 µF nominal capacitance at a 50 V rated voltage with ±20% tolerance (measured at 120 Hz, 20°C).
• Wide Operating Temperature Rated for −55°C to +105°C operation, enabling use across a broad range of thermal environments.
• High-temperature Reflow Compatibility Compatible with 260°C peak reflow soldering; recommended reflow condition: 260°C peak 5 s, 230°C over 60 s, 2 times (φ8 × 6.2, φ10 × 10: 1 time).
• Endurance & Reliability Endurance rating of 1000 hours at 105°C with defined limits for capacitance change, tan δ and leakage current after recovery to 20°C.
• Electrical Performance Specified leakage current after 2 minutes at 20°C not more than 0.01CV or 3 µA (whichever is greater). Ripple current ratings: 220 mA at 120 Hz and 330 mA at 10 kHz. Loss tangent (tan δ) ≤ 0.14 at 120 Hz for 50 V parts.
• Standards & Compliance AEC-Q200 qualified and RoHS compliant (2011/65/EU.(EU)2015/863), supporting regulated and reliability-conscious designs.

Typical Applications

• Automotive electronic modules — Suitable for electronic assemblies where AEC-Q200 qualification and wide temperature range are required.
• Surface-mount production lines — Designed for automatic placement using carrier tape and compatible with high-temperature reflow processes.
• High-temperature assembly environments — Specifically specified for 260°C peak reflow soldering to withstand modern soldering profiles.

Unique Advantages

• Automotive-grade reliability: AEC-Q200 qualification and 1000-hour endurance at 105°C provide documented performance for demanding applications.
• High-temperature process compatibility: Rated for 260°C peak reflow, enabling use in contemporary SMT assembly flows without additional process constraints.
• Robust electrical characteristics: Defined leakage current limits and ripple current ratings at both low and high frequencies support stable power-stage performance.
• Wide operating temperature: −55°C to +105°C rating allows deployment across a broad range of environmental conditions.
• Production-ready packaging: Carrier-tape compatibility and SMD radial can form factor simplify integration into automated manufacturing.

Why Choose UWZ1H221MCL1GS?

The UWZ1H221MCL1GS combines a high-capacitance 220 µF cell with a 50 V rating in a surface-mount radial can designed for automated assembly and high-temperature soldering. Its AEC-Q200 qualification, RoHS compliance, and specified endurance at 105°C make it a strong candidate for reliability-focused designs where thermal stress and long-term stability matter.

This part is suited to designers and buyers working on automotive and other regulated electronic systems that require compact surface-mount aluminum electrolytic capacitors with documented electrical and thermal performance.

Request a quote or submit an RFQ to evaluate UWZ1H221MCL1GS for your next design and to obtain current pricing and lead-time information.