UWZ1H330MCL1GS

The UWZ1H330MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface‑mount assembly and engineered for demanding temperature and manufacturing conditions. It provides 33 µF capacitance at a 50 V rating in a compact radial can SMD package (L: 7.7 × D: 6.3 mm) and is compatible with automated carrier‑tape feeding.

Targeted at automotive and robust industrial electronics, this part combines AEC‑Q200 qualification, wide operating temperature range (–55 °C to +105 °C), and compatibility with 260 °C peak reflow processes to simplify high‑temperature PCB assembly while maintaining long‑term endurance.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance at 120 Hz, 20 °C.
• Chip‑Type SMD Package — Radial can SMD package sized L: 7.7 × D: 6.3 mm with a recommended surface mount land size of 6.6 × 6.6 mm; compatible with automatic mounting machines fed by carrier tape.
• Wide Operating Temperature — Specified for operation from –55 °C to +105 °C to cover broad environmental ranges.
• High‑Temperature Reflow Compatibility — Designed for 260 °C peak reflow soldering; recommended reflow condition: 260 °C peak 5 s, 230 °C over 60 s, 2 times.
• Automotive‑Grade Reliability — AEC‑Q200 qualified for use in automotive applications that require component‑level qualification.
• Endurance & Shelf Life — Rated for 1000 hours at 105 °C with specified limits on capacitance change, tangent of loss angle, and leakage current after endurance testing.
• Leakage & Ripple Characteristics — Leakage current limit defined as not more than 0.01CV or 3 µA (whichever is greater) after 2 minutes at rated voltage and 20 °C; ripple current specified as 60 mA at 120 Hz and 90 mA at 100 kHz.
• Regulatory Compliance — RoHS compliant (2011/65/EU.(EU)2015/863).

Typical Applications

• Automotive electronics — Suitable for electronic modules that require AEC‑Q200 qualified components and a wide operating temperature range.
• Surface‑mount board assemblies — Designed for automatic mounting with carrier tape to support high‑volume PCB assembly processes.
• Compact power modules — Small radial can SMD footprint (L: 7.7 × D: 6.3 mm) for space‑constrained board designs.

Unique Advantages

• AEC‑Q200 Qualification: Delivers component‑level qualification for automotive use, reducing qualification effort for designers targeting automotive systems.
• 260 °C Reflow Compatibility: Enables use in high‑temperature reflow processes with a defined recommended profile, improving manufacturing flexibility.
• Wide Temperature Range: –55 °C to +105 °C operating range supports deployment across varied environmental conditions.
• Proven Endurance: 1000 hours at 105 °C rating with defined limits on capacitance and leakage provides predictable long‑term performance.
• Compact SMD Form Factor: Small L × D dimensions and carrier‑tape compatibility simplify automated placement and dense PCB layouts.
• Measured Ripple & Leakage Specs: Specified ripple current performance (60 mA at 120 Hz; 90 mA at 100 kHz) and clear leakage current limits help with power‑system design and margining.
• RoHS Compliant: Meets current RoHS directive requirements for regulatory and environmental conformity.

Why Choose UWZ1H330MCL1GS?

The UWZ1H330MCL1GS positions itself as a reliable, manufacturing‑friendly SMD aluminum electrolytic capacitor for automotive and industrial electronics. With AEC‑Q200 qualification, wide temperature operation, defined endurance, and compatibility with 260 °C reflow processes, it addresses the combined needs of robust field performance and high‑temperature assembly.

This part is well suited to designers looking for a compact, surface‑mount electrolytic solution that supports automated assembly, predictable ripple and leakage characteristics, and clear long‑term endurance specifications from a qualified supplier.

Request a quote or contact the sales team to discuss availability, lead times, and how UWZ1H330MCL1GS can fit into your next design or production run.