UZR1E220MCL1GB
| Part Description |
22 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,716 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UZR |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 22 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 3.95 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 63 mA @ 10 kHz | Ripple Current Low Frequency | 42 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 3.9 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of UZR1E220MCL1GB – 22 µF, 25 V Surface‑Mount Aluminum Electrolytic Capacitor
The UZR1E220MCL1GB is a chip‑type aluminum electrolytic capacitor designed for surface‑mount applications. It delivers 22 µF capacitance at a 25 V rating in a compact φ6.3 × 3.9 mm can‑style SMD package with embossed carrier taping for automated placement.
Targeted for automotive electronics, this AEC‑Q200‑rated, RoHS‑compliant device provides defined ripple current performance and a 1000‑hour endurance at 85 °C, making it suitable for compact power and energy‑storage functions within temperature‑constrained systems.
Key Features
- Capacitance & Voltage — 22 µF capacitance with ±20% tolerance at a 25 V rated voltage for typical power filtering and decoupling needs.
- Package & Mounting — Chip type, surface‑mount radial can (SMD) sized φ6.3 × 3.9 mm with a recommended PCB land of 6.6 × 6.6 mm; supplied on embossed carrier tape for automated assembly.
- Ripple Current Performance — Specified low‑frequency ripple current of 42 mA at 120 Hz and high‑frequency ripple current of 63 mA at 10 kHz to address both low and high frequency ripple environments.
- Low Leakage — Leakage current specified at 5.5 µA for minimized standby loss in voltage‑sensitive circuits.
- Reliability & Endurance — Endurance rating of 1000 hours at 85 °C with capacitance change within ±30% after the test interval.
- Automotive Grade & Compliance — AEC‑Q200 listed and RoHS‑compliant, meeting requirements for many automotive electronic applications.
- Operating Temperature — Rated for −40 °C to +85 °C operating range.
Typical Applications
- Automotive Electronic Modules — Suited for local energy storage and ripple suppression in vehicle control units where AEC‑Q200 qualification is required.
- Power Supply Filtering — Compact SMD package for board‑level smoothing and decoupling in space‑constrained power circuits.
- Sensor and Interface Electronics — Low leakage and defined ripple current performance make it applicable to devices that require stable biasing and low standby currents.
Unique Advantages
- Compact SMD Can Package: φ6.3 × 3.9 mm chip type minimizes board area while providing conventional electrolytic capacitance.
- Automated Assembly Ready: Embossed carrier taping simplifies high‑volume placement and reduces handling time on automated lines.
- Defined Ripple Performance: Separate low‑ and high‑frequency ripple current specifications (42 mA @ 120 Hz, 63 mA @ 10 kHz) support mixed‑frequency power environments.
- Automotive Reliability: AEC‑Q200 listing supports use in automotive electronics with industry‑recognized reliability requirements.
- Low Standby Loss: 5.5 µA leakage current helps reduce quiescent power draw in battery‑sensitive applications.
- High‑Temperature Endurance: 1000‑hour life at 85 °C provides predictable aging and endurance characteristics for design planning.
Why Choose UZR1E220MCL1GB?
UZR1E220MCL1GB combines a compact chip‑type SMD form factor with defined electrical and reliability specifications aimed at automotive and other demanding embedded power applications. Its combination of 22 µF/25 V rating, low leakage, measurable ripple capability, and AEC‑Q200 listing make it a strong candidate where board space, predictable endurance, and compliance matter.
Please note this part is scheduled for discontinuation and is not recommended for new designs; it remains a relevant option for sustaining existing designs that require the specific form factor and electrical profile provided here.
Request a quote or contact sales to discuss availability, lead times, and support for your existing designs using UZR1E220MCL1GB.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016