UZR1C330MCL1GB

The UZR1C330MCL1GB is a Nichicon aluminum electrolytic chip capacitor in a compact surface-mount can package. It delivers 33 µF capacitance at a 16 V rating, engineered for use on high-density PC boards and automated assembly with embossed carrier taping.

Designed for applications requiring controlled loss, ripple handling and automotive-grade reliability, this part combines a small footprint with specified electrical and endurance characteristics suitable for demanding embedded power circuits.

Key Features

• Capacitance & Voltage: 33 µF nominal capacitance with a 16 V rated voltage and ±20% tolerance, providing predictable bulk decoupling on low-voltage power rails.
• Loss and Ripple Performance: Rated tanδ 0.19 (max) at 20°C, 120 Hz, with specified ripple current of 49 mA at 120 Hz and 73.5 mA at 10 kHz for effective ripple suppression across common frequencies.
• Leakage Current: Low leakage current specified at 5.28 µA, helping minimize standby loss in low-current circuits.
• Thermal & Endurance Specification: Operating temperature range −40°C to 85°C with an endurance rating of 1000 hours at 85°C under rated voltage.
• Package & Mounting: Chip-type surface-mount can package sized Φ6.3 × 3.9 mm (L × D) with a recommended land pattern of 6.6 × 6.6 mm; supplied on embossed carrier tape for automated pick-and-place.
• Compliance & Qualification: RoHS compliant and AEC‑Q200 compliant to support reliability requirements for automotive and industrial applications.

Typical Applications

• Automotive Electronics: Bulk decoupling and smoothing in control modules where AEC‑Q200 qualification is required.
• Power Supply Decoupling: Local energy storage and ripple suppression on compact, high-density PCBs for DC power rails.
• Embedded Control Boards: General-purpose smoothing and standby bypassing in compact electronics assembled with automated placement.

Unique Advantages

• Compact surface-mount can: Φ6.3 × 3.9 mm chip package minimizes board area while providing 33 µF capacitance for space-constrained designs.
• Frequency-aware ripple capability: Specified ripple currents at 120 Hz and 10 kHz enable designers to account for both low- and high-frequency ripple conditions.
• Low leakage: 5.28 µA leakage current reduces quiescent losses, beneficial for low-power and standby-sensitive systems.
• Automated assembly ready: Embossed carrier taping supports high-volume, machine-fed placement to streamline manufacturing.
• Qualification for demanding environments: AEC‑Q200 compliance and 1000-hour endurance at 85°C support use in automotive and industrial-grade applications.
• Regulatory compliance: RoHS-compliant construction simplifies global regulatory acceptance.

Why Choose UZR1C330MCL1GB?

UZR1C330MCL1GB is positioned for designers needing a compact, surface-mount aluminum electrolytic that balances capacitance, ripple handling and long-term endurance. Its combination of a small can package, low leakage and defined ripple/current performance makes it suitable for rugged embedded power designs, particularly where automotive-grade qualification and automated assembly are required.

This part delivers verifiable electrical and environmental specifications—supporting predictable behavior in production designs and enabling straightforward integration on high-density PCBs.

If you would like pricing, availability or to request a formal quote for UZR1C330MCL1GB, please contact sales to discuss requirements and delivery options.