UZR1A330MCL1GB

The UZR1A330MCL1GB is a surface-mount aluminum electrolytic capacitor in a low-profile chip-style can designed for high-density PCB assemblies. It provides 33 µF of capacitance at a 10 V rating with a polarized construction suited for power decoupling and bulk energy storage in compact assemblies.

This part is AEC‑Q200 rated and RoHS compliant, making it applicable where automotive-grade component qualification and environmental compliance are required. Note: this specific part is listed as End Of Life.

Key Features

• Capacitance & Tolerance — 33 µF nominal capacitance with ±20% tolerance at 120 Hz, 20°C for predictable decoupling behavior.
• Rated Voltage — 10 V working voltage suitable for low-voltage power rails and local energy storage.
• Package & Mounting — Surface-mount chip can package (radial, can - SMD) with package dimensions 5.0 mm diameter × 3.9 mm length and surface mount land size 5.3 mm × 5.3 mm for automated PCB assembly.
• Ripple Current Performance — Low‑frequency ripple current 41 mA at 120 Hz and high‑frequency ripple current 61.5 mA at 10 kHz, with frequency coefficients provided for other frequencies.
• Leakage & Dissipation — Leakage current specified at 3.3 µA; tangent of loss angle (tan δ) up to 0.24 at rated voltage (10 V) under standard measurement conditions.
• Temperature & Endurance — Operating temperature range −40°C to +85°C with endurance rated for 1000 hours at 85°C; capacitance change, tan δ, and leakage current meet specified endurance limits after test.
• Assembly-Friendly Packaging — Supplied in embossed carrier tape for compatibility with automatic mounting machines and high-volume placement.
• Compliance — RoHS directive compliant and AEC‑Q200 qualified for designs requiring automotive-grade components.

Typical Applications

• Automotive electronics — Local decoupling and energy storage in modules where AEC‑Q200 qualification is required.
• Power rail decoupling — Stabilization of low-voltage power rails and smoothing of supply transients on compact PCBs.
• High-density assemblies — Surface-mount chip can form factor for space-constrained designs assembled with automated tape-and-reel pick-and-place.

Unique Advantages

• Compact SMD form factor: Small 5.0 mm × 3.9 mm can size delivers 33 µF capacitance in a low-profile package for space-constrained boards.
• Automated assembly ready: Embossed carrier taping and chip-type construction support high-volume pick-and-place production.
• Automotive-capable qualification: AEC‑Q200 rating provides traceable qualification for automotive applications requiring validated components.
• Targeted ripple handling: Specified ripple currents at 120 Hz and 10 kHz allow designers to size capacitors based on expected operating frequencies.
• Wide operating temperature: −40°C to +85°C range with 1000-hour endurance at 85°C supports sustained performance in elevated-temperature environments.

Why Choose UZR1A330MCL1GB?

UZR1A330MCL1GB is positioned for compact, assembly-friendly power-filtering and decoupling roles where a polarized aluminum electrolytic in a small SMD can is required. Its combination of 33 µF capacitance, 10 V rating, and AEC‑Q200 compliance makes it suitable for engineers specifying automotive-qualified components for constrained board real estate.

The component’s embossed carrier taping and chip-type package simplify automated placement, while specified ripple current, leakage, and endurance data enable reliable design decisions for moderate-temperature applications. Note that this part is listed as End Of Life; please verify availability and long-term sourcing requirements for your program.

Request a quote or submit an availability inquiry to check current stock, lead time, and to discuss alternative or successor parts for your design needs.