UZR0J470MCL1GB

The UZR0J470MCL1GB is a compact surface-mount aluminum electrolytic capacitor in a chip-style can designed for high-density PC board assemblies. It delivers 47 µF capacitance at 6.3 V with AEC-Q200-rated reliability for automotive-focused applications.

Key value comes from its small footprint (5.0 × 3.9 mm), low leakage, defined ripple current ratings across low and high frequencies, and packaging optimized for automated placement (embossed carrier taping).

Key Features

• Electrical Performance — 47 µF capacitance with ±20% tolerance and tanδ (DF) 0.3 measured at 20°C, 120 Hz; leakage current specified at 3 µA.
• Rated Voltage & Ripple Handling — Rated to 6.3 V with low-frequency ripple current of 45 mA (120 Hz) and high-frequency ripple current of 67.5 mA (10 kHz).
• Reliability & Endurance — AEC-Q200 compliant construction and endurance specified as 1000 hours at 85°C, with defined limits for capacitance change, tanδ and leakage after the endurance test.
• Temperature Range — Operates across −40°C to +85°C, suitable for temperature-variant environments typical in automotive electronics.
• Compact Surface-Mount Package — Chip-type radial can SMD package, dimension 5.0 mm diameter × 3.9 mm length, designed for high-density PCBs and automatic mounting systems.
• Assembly-Ready Packaging — Supplied in embossed carrier taping for pick-and-place compatibility with automatic placement equipment.
• Compliance — RoHS compliant.

Typical Applications

• Automotive electronics — Designed for use in automotive control modules and subsystems where AEC-Q200 compliance and robust temperature performance are required.
• High-density surface-mount assemblies — Small chip-form can and tape packaging make it suitable for compact boards that require board-level decoupling and bulk capacitance.
• Automated production lines — Embossed carrier taping supports high-speed pick-and-place assembly for volume manufacturing.

Unique Advantages

• AEC-Q200 Rated: Provides documented automotive-grade reliability for designs targeting vehicle electronics.
• Compact footprint: 5.0 × 3.9 mm package offers significant capacitance in a small SMD chip can, enabling space-constrained layouts.
• Defined ripple performance: Published ripple current values for 120 Hz and 10 kHz let designers size capacitors according to real-world low- and high-frequency ripple demands.
• Low leakage current: Leakage specified at 3 µA supports low-power and bias-stable circuits.
• Assembly-ready packaging: Embossed carrier taping streamlines automated placement and reduces handling time on production lines.
• Endurance documented: 1000 hours at 85°C with post-test limits for capacitance, tanδ and leakage supports predictable lifecycle behavior.

Why Choose UZR0J470MCL1GB?

The UZR0J470MCL1GB combines compact SMD packaging, automotive-grade qualification, and clearly specified electrical and endurance characteristics—making it well suited for engineers building compact, production-level automotive and industrial modules. Its defined ripple current ratings and low leakage current enable confident selection for power rail decoupling and bulk capacitance roles in space-constrained designs.

This part is appropriate for teams that require AEC-Q200-level reliability, pick-and-place friendly tape packaging, and documented endurance performance for designs operating between −40°C and +85°C.

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