UZR1A470MCL1GB

The UZR1A470MCL1GB is a chip-type aluminum electrolytic capacitor optimized for surface-mount use on high-density PC boards. It delivers 47 µF at a 10 V rating in a compact SMD can package designed for automated assembly with carrier-tape feed.

Built to meet AEC-Q200 and RoHS requirements, this part is positioned for applications that require proven electrolytic capacitance in compact surface-mount form factors, with defined endurance and ripple characteristics for controlled environments.

Key Features

• Capacitance & Voltage — 47 µF rated capacitance at 10 V with polarization suitable for typical DC decoupling and smoothing tasks.
• Chip SMD Package — Radial, can-style SMD package designed for surface mounting on high-density PCBs and compatible with automatic mounting via carrier tape.
• Temperature Range — Specified operating range of −40 °C to +85 °C for consistency across common automotive and industrial environments.
• Endurance — Rated for 1000 hours at 85 °C with defined end-of-test limits: capacitance change within ±30% and leakage current at or below initial specified value after test.
• Ripple Current Performance — Ripple allowances of 52 mA at 120 Hz and 78 mA at 10 kHz, with frequency coefficients provided in the series datasheet for calculating ripple at other frequencies.
• Tolerance & Leakage — Capacitance tolerance of −20% to +20%; leakage current specified as not more than 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C.
• Compliance & Reliability — RoHS compliant and AEC-Q200 listed to address reliability expectations where AEC qualification is required.
• Board Land & Package Dimensions — Compact footprint with part body dimension L: 3.9 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm for surface-mount placement.

Typical Applications

• Automotive Electronics — Suited for automotive electronic modules where AEC-Q200 qualification is required and compact electrolytic capacitance is needed.
• High-Density Surface-Mount PCBs — Designed for use on densely populated boards requiring automated placement from carrier tape.
• Power Decoupling and Smoothing — Practical for localized decoupling or smoothing tasks in compact power management circuits within the specified temperature and ripple limits.

Unique Advantages

• AEC-Q200 Listing: Provides an established qualification basis for reliability-focused designs in applicable markets.
• Carrier-Tape Compatible SMD Can: Enables automated placement on high-density PCBs to simplify manufacturing and reduce assembly time.
• Defined Endurance: 1000 hours at 85 °C with measured limits for capacitance, tan δ and leakage current supports predictable lifecycle planning.
• Compact Footprint: Small body and defined land pattern support miniaturized board layouts while maintaining needed capacitance.
• RoHS Compliant: Meets regulatory substance restrictions for environmentally conscious designs.
• Measured Ripple Data: Specified ripple currents at 120 Hz and 10 kHz and provided frequency coefficients allow accurate ripple sizing in design calculations.

Why Choose UZR1A470MCL1GB?

UZR1A470MCL1GB combines a compact chip-style SMD can with well-documented electrical and endurance characteristics suitable for engineers specifying electrolytic capacitance in space-constrained assemblies. Its AEC-Q200 listing, RoHS compliance, and carrier-tape compatibility make it a practical choice for production lines and reliability-aware applications.

This part is appropriate for designers who need clear ripple, leakage and endurance specifications tied to a small SMD package and who value components with established qualification data and assembly-ready packaging.

Please note: this product is scheduled for discontinuation and is not recommended for new designs.

If you would like pricing, availability, or a formal quote for UZR1A470MCL1GB, please request a quote or submit an inquiry and our team will respond with the details you need.