UZR0J330MCL1GB
| Part Description |
33 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,512 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UZR |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 3.95 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 55.5 mA @ 10 kHz | Ripple Current Low Frequency | 37 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 3.9 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UZR0J330MCL1GB – 33 µF, 6.3 V Surface-Mount Aluminum Electrolytic Capacitor
The UZR0J330MCL1GB is a chip-type aluminum electrolytic capacitor in a compact surface-mount package designed for high-density printed circuit boards. With a rated capacitance of 33 µF at 6.3 V and polar construction, it is intended for use in automotive-grade electronic modules where board space and automated assembly are priorities.
Built to industry reliability standards and RoHS compliant, this capacitor supports applications that require stable filtering and decoupling across a wide operating temperature range and defined endurance at elevated temperatures.
Key Features
- Capacitance & Voltage — 33 µF nominal capacitance rated at 6.3 V for bulk decoupling and local energy storage on low-voltage rails.
- Surface-Mount Chip Package — Chip-type construction optimized for high-density PCBs and compatible with carrier tape for automatic placement.
- Package Dimensions — Compact footprint with body dimensions of 3.9 × 5 mm; recommended land size 5.3 × 5.3 mm for PCB layout.
- Temperature Range — Rated for operation from −40 °C to +85 °C to match common in-vehicle and industrial ambient conditions.
- Reliability & Endurance — AEC-Q200 compliant; specified endurance of 1000 hours at 85 °C with rated voltage applied.
- Ripple Performance — Specified ripple current values provided for low- and high-frequency conditions (37 mA at 120 Hz; 55.5 mA at 10 kHz), aiding thermal and lifetime planning.
- Tolerance & Polarization — ±20% capacitance tolerance at 120 Hz, 20 °C; polarized device for correct orientation in circuits.
- Environmental Compliance — Compliant with RoHS (2011/65/EU,(EU)2015/863).
Typical Applications
- Automotive power rail decoupling — Local smoothing and noise reduction on low-voltage automotive control modules and power distribution boards.
- Sensor and actuator electronics — Energy buffering and transient suppression in compact sensor interface and actuator driver circuits.
- High-density PCB assemblies — Space-efficient SMD chip style supports automatic tape-fed placement for tightly packed boards.
Unique Advantages
- AEC-Q200 qualification — Designed to meet automotive reliability requirements, supporting designs intended for vehicle environments.
- Compact, assembly-friendly package — Chip-type SMD format and tape-feeding compatibility streamline automated manufacturing on dense PCBs.
- Clear thermal and endurance data — Rated for −40 °C to +85 °C with a specified 1000-hour endurance at 85 °C, enabling predictable lifetime planning.
- Frequency-aware ripple ratings — Provided ripple current specifications at 120 Hz and 10 kHz help size components for application-specific stress and heating.
- RoHS compliance — Meets current RoHS requirements for regulatory conformity in production supply chains.
Why Choose UZR0J330MCL1GB?
UZR0J330MCL1GB delivers a practical balance of capacitance, compact footprint, and automotive-grade reliability for designers working on space-constrained vehicle electronics and high-density assemblies. Its surface-mount chip design and tape-feed compatibility make it suitable for automated production environments where footprint and placement efficiency matter.
This part is appropriate for engineers and procurement teams seeking a well-documented electrolytic solution with defined endurance and ripple specifications, alongside industry-standard environmental and qualification credentials.
If you would like pricing, availability, or a formal quote for UZR0J330MCL1GB, please request a quote or submit an inquiry and our team will respond with the next steps.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016