10AT090S2F45E2SG

The 10AT090S2F45E2SG is an Intel Arria 10 GT Field Programmable Gate Array (FPGA) in a 1932-ball BGA (FCBGA) package. This extended-grade, surface-mount device delivers a large programmable fabric with 900,000 logic elements and 59,234,304 total RAM bits, plus 624 user I/Os for high-density designs.

This device targets applications that require significant on‑chip logic and memory capacity while operating within a core voltage range of 870 mV to 930 mV and an ambient operating temperature range of 0 °C to 100 °C.

Key Features

• High Logic Capacity — 900,000 logic elements (cells) enable large-scale programmable logic implementations and complex custom functions.
• Substantial On‑Chip Memory — 59,234,304 total RAM bits support large buffering, packet processing, and data‑intensive algorithms directly in the FPGA fabric.
• Extensive I/O — 624 I/O pins provide broad connectivity for multi‑lane, multi‑channel interfaces and dense board‑level integration.
• Package and Mounting — 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45); surface‑mount mounting for modern PCB assembly.
• Power and Voltage — Core voltage supply specified from 870 mV to 930 mV to support the device’s operating requirements.
• Extended Grade — Device grade specified as Extended, with operating temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High‑density logic designs — Implement large custom logic functions and complex processing pipelines using 900,000 logic elements and extensive on‑chip RAM.
• Multi‑channel interfacing — Support systems that require large numbers of parallel I/Os or mixed interfaces with the device’s 624 I/O pins.
• Board‑level integration and prototyping — The 1932‑ball FCBGA package and surface‑mount mounting make the device suitable for compact, high‑pin‑count PCB designs.

Unique Advantages

• Large integrated fabric: 900,000 logic elements reduce the need for external logic devices and consolidate complex functions on a single device.
• Massive on‑chip RAM: 59,234,304 bits of RAM allow significant data buffering and in‑FPGA memory structures, reducing external memory dependencies.
• High I/O density: 624 I/Os enable dense connectivity for multi‑lane and multi‑channel applications, simplifying system routing.
• Robust package option: 1932‑BBGA (FCBGA) with a 45×45 supplier package footprint supports compact, high‑pin PCB layouts.
• Defined operating envelope: Specified core voltage range (870–930 mV) and operating temperature (0 °C–100 °C) provide clear design constraints for power and thermal planning.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assembly processes.

Why Choose 10AT090S2F45E2SG?

The 10AT090S2F45E2SG Arria 10 GT FPGA combines substantial logic capacity, large on‑chip RAM, and a high I/O count in a single extended‑grade FCBGA package. These measurable attributes make it suitable for designs that require consolidated programmable logic, significant embedded memory, and dense board connectivity within a well-defined power and thermal envelope.

This device is a fit for teams and projects that need scalable FPGA resources and predictable electrical and packaging specifications for system integration, evaluation, and deployment.

Request a quote or submit a pricing inquiry to begin design evaluation and procurement for the 10AT090S2F45E2SG FPGA.