10AT115N4F40E3SGES

IC FPGA 600 I/O 1517FBGA
Part Description

Arria 10 GT Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA

Quantity 462 Available (as of May 22, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AT115N4F40E3SGES – Arria 10 GT Field Programmable Gate Array (FPGA) IC

The 10AT115N4F40E3SGES is an Intel Arria 10 GT mid-range FPGA device optimized for high-performance, power-efficient designs. It is part of the Arria 10 family of 20 nm FPGAs and SoCs and targets applications that require large logic capacity, significant on-chip memory, and advanced transceiver and I/O capabilities.

With 1,150,000 logic elements, 68,857,856 total RAM bits, and 600 I/O pins in a 1517-BBGA FCBGA package, this extended-grade, surface-mount device is suited to wireless, wireline, broadcast, computing, medical and defense applications where integration, configurable logic and programmable connectivity are required.

Key Features

  • Core Logic  1,150,000 logic elements provide a large programmable fabric for implementing complex digital logic, custom accelerators and protocol engines.
  • Embedded Memory  68,857,856 total RAM bits of on-chip memory support large buffering, caches and table storage without external memory for many functions.
  • I/O Capacity  600 I/O pins accommodate extensive board-level interfacing, multiple memory channels, and diverse peripheral connectivity.
  • Transceivers and High-Speed Interfaces  Arria 10 GT family features low-power serial transceivers and enhanced PCS hard IP; the device family supports standards such as PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet as described in the device overview.
  • DSP and Arithmetic  Variable-precision DSP blocks and adaptive logic modules enable efficient implementation of signal processing, filtering and numeric acceleration.
  • Configuration and Reconfiguration  Supports dynamic and partial reconfiguration to update regions of the design in the field and enable flexible system operation.
  • System Reliability  Includes SEU error detection and correction mechanisms and power-management features referenced in the device documentation to support robust operation.
  • Package and Mounting  1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40) in a surface-mount format for dense, production-ready board integration.
  • Voltage and Temperature Range  Operates from 870 mV to 930 mV and is specified for 0 °C to 100 °C operating temperature in an Extended grade.
  • Standards and Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel cards, switch cards and mobile backhaul equipment leveraging the device’s logic capacity, DSP resources and transceivers for PHY/MAC functions.
  • High-Speed Wireline  Optical and Ethernet line cards, 40G/100G muxponders and transponders using on-chip memory and hard IP for packet processing and protocol handling.
  • Broadcast and Professional AV  Studio switches, transport and video processing systems that need large buffering, deterministic I/O and configurable logic for custom processing chains.
  • Compute and Storage Acceleration  Cloud and server acceleration tasks such as flash cache and custom data paths that benefit from abundant logic, embedded RAM and DSP resources.
  • Medical and Defense Systems  Imaging, radar and secure communications applications that rely on configurable processing, robust SEU handling and extended-grade operation.

Unique Advantages

  • High Logic Density: The 1,150,000 logic elements let you consolidate complex designs and reduce the need for multiple devices.
  • Substantial On‑Chip Memory: 68,857,856 RAM bits reduce external memory dependence and simplify board-level design for buffering and caching.
  • Extensive I/O and Packaging: 600 I/Os in a 1517-BBGA FCBGA surface-mount package enable dense I/O integration and compact board layouts.
  • Advanced Interface Support: Family-level support for PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet hard IPs accelerates development of high-speed links and protocol stacks.
  • Reconfiguration and Reliability: Dynamic and partial reconfiguration combined with SEU detection and correction support adaptable, resilient systems.
  • Power and Thermal Parameters: Narrow supply voltage window (870–930 mV) and extended-grade operating range (0 °C to 100 °C) allow predictable power planning and thermal design.

Why Choose 10AT115N4F40E3SGES?

The 10AT115N4F40E3SGES delivers a balanced mix of large programmable capacity, significant embedded memory and extensive I/O in an Arria 10 GT family device. It is positioned for mid-range applications that demand configurable logic, integrated DSP and transceiver capabilities along with predictable power and thermal behavior.

This device is well suited to system designers building wireless infrastructure, high‑speed wireline, broadcast, compute/storage acceleration, medical imaging and defense systems where consolidation of functions into a single FPGA can reduce BOM and simplify board design. The Arria 10 device overview documents describe family features such as hard IP for common interfaces, power-management options and reconfiguration capabilities that support long-term scalability and field-upgradeable designs.

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