10AT115S2F45E2SGE2

IC FPGA 624 I/O 1932FCBGA
Part Description

Arria 10 GT Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,204 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AT115S2F45E2SGE2 – Arria 10 GT FPGA, 1,150,000 logic elements, 1932‑FCBGA

The 10AT115S2F45E2SGE2 is an Arria 10 GT field‑programmable gate array (FPGA) IC from Intel, built on the Arria 10 device family architecture. This mid‑range, power‑efficient 20 nm FPGA delivers high logic density and on‑chip memory suitable for performance‑sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.

Key hardware attributes include 1,150,000 logic elements, 68,857,856 total RAM bits, 624 I/Os, a 1932‑FCBGA (45×45) surface‑mount package, extended temperature grading and RoHS compliance—making it appropriate for complex, high‑integration system designs.

Key Features

  • Core Capacity — 1,150,000 logic elements provide high implementation density for complex FPGA designs.
  • Logic Clusters (CLBs) — 427,200 CLBs to structure logic resources and support large, parallel designs.
  • On‑Chip Memory — 68,857,856 total RAM bits for embedded data buffering, packet processing and on‑chip storage.
  • I/O and Connectivity — 624 I/O pins to support broad interfacing and high‑pin‑count system integration.
  • Arria 10 GT Series Features — Series‑level capabilities include low‑power serial transceivers, PCIe Gen1/2/3 hard IP and support for 10 Gbps Ethernet and Interlaken protocols as described in the device family documentation.
  • Package and Mounting — 1932‑FCBGA (45×45) package, surface‑mount for compact, high‑density board designs.
  • Power Supply — Core voltage supply range from 870 mV to 930 mV to match system power rails.
  • Temperature and Grade — Extended grade operation from 0 °C to 100 °C; RoHS compliant for environmental standards.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards or remote radio head functions where high logic density and embedded memory support signal processing and baseband tasks.
  • Wireline Networking — 40G/100G muxponders, transponders and line cards leveraging on‑chip memory and I/O bandwidth for high‑speed packet processing.
  • Broadcast and Media — Studio switches and professional audio/video transport systems requiring flexible logic and high I/O counts for routing and format conversion.
  • Computing and Storage Acceleration — Server offload, flash cache and cloud acceleration applications that use dense logic and memory for custom compute kernels.
  • Medical Imaging and Diagnostics — Diagnostic imaging subsystems that need large on‑chip memory and configurable logic for real‑time data handling and preprocessing.

Unique Advantages

  • High logic density: 1,150,000 logic elements enable complex system functions to be integrated on a single device, reducing BOM and board area.
  • Large embedded memory: 68,857,856 total RAM bits support buffering, frame storage and large on‑chip datasets without external memory in some use cases.
  • Broad I/O capability: 624 I/Os provide flexible interfacing options for multi‑lane serial links, parallel buses and mixed‑signal front ends.
  • Series‑level protocol IP: Arria 10 GT family features documented support for PCIe Gen1/2/3 and high‑speed Ethernet/Interlaken, simplifying implementation of standard interfaces.
  • Compact, manufacturable package: 1932‑FCBGA (45×45) surface‑mount packaging enables high‑density PCB layouts while supporting robust assembly processes.
  • Operational robustness: Extended grade temperature range (0 °C to 100 °C) and RoHS compliance align with demanding deployment environments and regulatory requirements.

Why Choose 10AT115S2F45E2SGE2?

The 10AT115S2F45E2SGE2 positions itself as a high‑capacity, mid‑range Arria 10 GT FPGA optimized for designs that require significant logic density, on‑chip memory and a large set of I/O. Its combination of 1,150,000 logic elements, substantial RAM capacity and series‑level connectivity features make it suitable for system designs in networking, wireless infrastructure, broadcast, compute acceleration and medical imaging.

Designers benefit from the Arria 10 device family documentation and feature set to implement standard protocols and advanced interfaces, while the extended temperature grade and RoHS compliance support reliable, environmentally conscious deployments.

Request a quote or submit a pricing inquiry to evaluate the 10AT115S2F45E2SGE2 for your next FPGA‑based project.

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