10AT115U3F45E2SGE2

The 10AT115U3F45E2SGE2 is an Intel Arria 10 GT field-programmable gate array (FPGA) in a 1932-ball FCBGA package. It is part of the 20‑nm Arria 10 device family designed for mid-range, high-performance and power-sensitive applications.

With very high logic density, large embedded RAM capacity and extensive I/O, this device targets applications across wireless, wireline, broadcast, computing and other markets that require programmable system integration and performance efficiency.

Key Features

• Core Logic Density — 1,150,000 logic elements for implementing large, complex designs and high-integration system functions.
• Embedded Memory — 68,857,856 total RAM bits to support on-chip buffering, caches and memory-intensive functions.
• I/O Capacity — 624 I/O pins to connect high-speed interfaces, memory buses and external peripherals.
• Transceiver and Protocol Support (Series-Level) — Arria 10 GT devices include low-power serial transceivers and hard IP for protocols such as PCIe and 10 Gbps Ethernet as described in the Arria 10 device overview.
• DSP and Logic Architecture (Series-Level) — Variable‑precision DSP blocks and adaptive logic modules are part of the Arria 10 family architecture to accelerate signal processing and compute kernels.
• Clocking and PLLs (Series-Level) — Rich clock networks, fractional synthesis and I/O PLL resources are specified for flexible timing and multi-rate clocking.
• Package & Mounting — 1932‑FCBGA (45 × 45 mm) surface-mount package for high-pin-count board integration.
• Power Supply — Core voltage operating range from 870 mV to 930 mV.
• Operating Temperature — Rated for 0 °C to 100 °C.
• Regulatory — RoHS compliant.
• Grade — Extended temperature grade.

Typical Applications

• Wireless infrastructure — Channel and switch card functions in remote radio heads and mobile backhaul where programmable logic and transceivers enable flexible PHY and fronthaul implementations.
• Wireline networking — Line cards, muxponders and transponders in 40G/100G systems that benefit from on‑chip packet processing and protocol hard IP.
• Broadcast and Pro AV — Studio switching, transport and professional video processing requiring substantial on-chip memory and I/O connectivity.
• Compute and Storage Acceleration — Server offload, flash cache and cloud acceleration tasks that leverage high logic density and embedded memory.

Unique Advantages

• High integration density: 1,150,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and complexity.
• Large on-chip memory: Nearly 69 Mbits of RAM supports buffering, lookup tables and memory-intensive accelerators without immediate external memory dependence.
• Extensive I/O and package: 624 I/Os in a 1932‑FCBGA package provide the pins and form factor needed for dense system interfaces and high-bandwidth routing.
• Power-aware design: The Arria 10 family is described as power-efficient at 20‑nm, and the device operates with a defined core voltage window (870–930 mV) for controlled power design.
• Series-level protocol and transceiver support: Arria 10 GT devices include serial transceivers and hard IP for common high-speed protocols, simplifying high-rate link implementation.
• Qualified operating range: Extended-grade device rated from 0 °C to 100 °C for deployment in temperature-controlled systems.

Why Choose 10AT115U3F45E2SGE2?

The 10AT115U3F45E2SGE2 delivers a combination of high logic capacity, substantial embedded RAM and broad I/O in a high-ball-count FCBGA package—making it suitable for mid-range designs that require significant on-chip programmability and interface density. As a member of the Intel Arria 10 GT family, it benefits from the series' architecture for DSP acceleration, transceiver capability and flexible clocking.

This device is well suited for engineers and system designers building wireless infrastructure, high-speed networking, professional broadcast and compute acceleration platforms who need scalable performance, programmable integration and defined electrical and thermal operating envelopes.

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