10AX032H2F34E1HG

The 10AX032H2F34E1HG is an Arria 10 GX family FPGA offered in a 1152‑pin FCBGA package. As part of the Intel Arria 10 device family, this device targets high-performance, power-efficient mid-range FPGA and SoC applications using a 20 nm architecture.

With 320,000 logic elements, 21,040,128 bits of on-chip RAM and 384 I/O, this device is suited for designs that require substantial programmable logic, embedded memory and flexible external connectivity in a compact surface‑mount package.

Key Features

• Logic Capacity 320,000 logic elements to implement complex digital functions and large-scale integration.
• Embedded Memory 21,040,128 total RAM bits for on-chip buffering, caches and data storage requirements.
• I/O 384 general-purpose I/O pins for broad external interfacing and system integration.
• Package & Mounting 1152‑FCBGA (35×35) package; surface‑mount mounting type for high pin count designs.
• Power Core voltage supply range 870 mV to 980 mV to support low‑voltage operation.
• Operating Range & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
• Family-Level Capabilities Arria 10 device family features documented in the device overview include variable‑precision DSP blocks, embedded memory blocks, flexible clock networks and PLL clock sources, hard IP for PCIe and serial protocols, low‑power serial transceivers, and support for dynamic and partial reconfiguration.
• Compliance RoHS‑compliant.

Typical Applications

• Wireless Infrastructure Channel processing, switch and remote radio head functions that benefit from high logic density and embedded memory.
• Wireline & Optical Networking Line cards and aggregation equipment where programmable logic and extensive I/O are required.
• Compute & Storage Acceleration Server and storage acceleration tasks leveraging large FPGA logic and on-chip RAM for data paths and buffering.
• Broadcast & Professional AV Video and audio processing, switching and transport applications that use embedded memory and DSP resources.

Unique Advantages

• High Logic Density: 320,000 logic elements provide capacity for complex algorithms and multi-function integration on a single device.
• Substantial On‑Chip Memory: Over 21 million bits of RAM reduce external memory dependence and lower system latency for data‑intensive designs.
• Broad I/O Count: 384 I/O pins enable versatile connectivity for multi‑lane interfaces and dense peripheral integration.
• Compact, High‑Pin Package: 1152‑FCBGA (35×35) delivers a high pin count in a compact footprint for space‑constrained PCBs.
• Low‑Voltage Core Operation: 870 mV–980 mV supply range supports power‑sensitive designs while aligning with Arria 10 power management capabilities.
• Extended Temperature Grade: Rated 0 °C to 100 °C for deployments that require extended operating range.

Why Choose 10AX032H2F34E1HG?

The 10AX032H2F34E1HG positions itself as a high‑capacity, mid‑range FPGA option within the Arria 10 family, combining substantial logic and embedded memory with a high I/O count and a compact 1152‑pin FCBGA package. Its extended grade and low‑voltage core make it suitable for power‑sensitive, performance‑oriented designs that demand on‑chip resources and flexible external connectivity.

This device is appropriate for engineering teams building wireless infrastructure, networking equipment, compute/storage accelerators and professional AV systems that require a balance of logic capacity, embedded RAM and system‑level integration backed by the Arria 10 device ecosystem documentation.

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