10AX032H1F35E1SG

The 10AX032H1F35E1SG is an Intel Arria 10 GX FPGA in a 1152-FCBGA (35×35) package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs, designed for high-performance, power-efficient applications across diverse markets.

Typical use cases include midrange, power-sensitive systems that require large programmable logic capacity, significant embedded memory, and substantial I/O connectivity for networking, broadcast, computing, medical and defense applications.

Key Features

• Logic Capacity  Approximately 320,000 logic elements to support complex programmable logic and custom datapaths.
• Embedded Memory  Total embedded RAM of 21,040,128 bits to store high-bandwidth buffers and on-chip data structures.
• I/O Resources  384 device I/O pins for extensive external interfacing and parallel connectivity.
• Package and Mounting  1152-ball FCBGA package (35×35) with surface-mount assembly for compact board integration.
• Voltage Supply  Core supply range of 870 mV to 980 mV to support the device’s power architecture.
• Operating Range  Rated for 0 °C to 100 °C operating temperature; device grade is Extended.
• Power-Efficient 20 nm Architecture  Part of the Arria 10 family noted for higher performance and power efficiency among mid-range FPGAs.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and on-chip memory.
• Wireline Networking  Line cards, muxponders and transponders where configurable logic and extensive I/O support high-speed data aggregation and bridging.
• Broadcast and Pro AV  Studio switching and professional audio/video transport applications that benefit from flexible logic and embedded memory for media processing.
• Computing and Storage  Server acceleration and flash-caching functions that require substantial logic and on-chip RAM.
• Medical and Defense Systems  Diagnostic imaging, radar, and secure communications that leverage programmable logic for specialized processing tasks.

Unique Advantages

• Large Programmable Capacity:  Approximately 320,000 logic elements enable implementation of complex algorithms and custom hardware accelerators on a single device.
• Significant On-Chip Memory:  Over 21 million bits of embedded RAM reduce external memory dependence for buffering and real-time data processing.
• High I/O Count:  384 I/O pins allow broad interfacing options for parallel buses, high-density connectors, and multi-channel designs.
• Compact Ball-Grid Package:  1152-FCBGA (35×35) delivers a high-density package option for space-constrained PCBs.
• Designed for Power Efficiency:  Part of the Arria 10 family built on a 20 nm architecture focused on achieving higher performance with power-aware design.
• Extended Operating Grade:  Rated for 0 °C to 100 °C operation to meet a broad range of commercial and conditioned-environment deployments.

Why Choose 10AX032H1F35E1SG?

The 10AX032H1F35E1SG combines substantial logic density, large embedded RAM, and a high I/O count in a compact 1152-FCBGA package—positioning it for midrange designs that demand programmable performance with power-conscious operation. Its place in the Arria 10 GX family aligns it with a 20 nm device architecture engineered for performance and efficiency.

This device is suitable for developers and system designers building networking, broadcast, computing, medical, and defense applications that require scalable FPGA resources and flexible I/O. Family-level device variants and package options support migration and scaling across Arria 10 devices.

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