10AX032H1F34I1HG

The 10AX032H1F34I1HG is an Intel Arria 10 GX series FPGA delivered in a 1152-BBGA (1152-FCBGA, 35×35 mm) package. It is a 20 nm mid-range FPGA optimized for high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical and military markets.

With 320,000 logic elements, 21,040,128 total RAM bits and 384 I/O, this device targets midrange designs that require significant logic density, embedded memory and flexible I/O routing while operating across an industrial temperature range.

Key Features

• Core Logic  320,000 logic elements provide high-density programmable logic for complex midrange designs.
• Embedded Memory  21,040,128 total RAM bits for on-chip buffering, state storage and memory-intensive functions.
• I/O Resources  384 I/O pins to support broad interfacing and parallel connectivity needs for external devices and subsystems.
• Voltage and Power  Supports core supply voltage from 870 mV to 980 mV, enabling designs that target the device’s specified power envelope.
• Package  Available in a 1152-BBGA (1152-FCBGA, 35×35 mm) package for surface-mount PCB assembly and compact system integration.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C, suitable for industrial environments and temperature-constrained applications.
• Arria 10 Family Characteristics  Part of the Intel Arria 10 device family designed as 20 nm mid-range FPGAs with an emphasis on performance and power efficiency.

Typical Applications

• Wireless infrastructure  Channel and switch card functions in remote radio heads and mobile backhaul equipment where logic density and I/O are critical.
• Wireline networking  Line cards, muxponders and transponders in 40G/100G systems that require programmable packet processing and protocol handling.
• Broadcast and professional AV  Studio switches, video transport and conferencing equipment that need embedded memory and flexible I/O interfaces.
• Compute and storage acceleration  Flash cache controllers, server acceleration and cloud infrastructure tasks leveraging on-chip logic and RAM.
• Medical and defense systems  Diagnostic imaging, radar and secure communications where industrial temperature range and device documentation are important.

Unique Advantages

• High logic density: 320,000 logic elements enable implementation of substantial digital logic and complex algorithms on-chip, reducing external component count.
• Large on-chip memory: Over 21 million RAM bits support deep buffering, data path staging and memory-hungry processing without immediate reliance on external memory.
• Extensive I/O capacity: 384 I/O pins allow flexible interfacing to peripherals, high-speed lanes and parallel buses for system-level connectivity.
• Industrial-temperature operation: Rated from -40 °C to 100 °C for deployment in industrial and temperature-challenged environments.
• Compact, surface-mount package: 1152-FCBGA (35×35 mm) package supports dense board layouts and streamlined mechanical integration.
• Power-aware 20 nm architecture: Part of the Arria 10 family designed for performance with power-efficiency considerations in midrange FPGA applications.

Why Choose 10AX032H1F34I1HG?

The 10AX032H1F34I1HG Arria 10 GX FPGA combines high logic capacity, significant embedded RAM and broad I/O resources in an industrial-temperature, surface-mount package. It is positioned for midrange designs that require a balance of performance and power efficiency while benefiting from the Arria 10 device family’s documented features and device guidance.

Choose this device when your application needs scalable programmable logic, on-chip memory for data handling, and a compact FCBGA package for integration into wireless, wireline, broadcast, compute, medical or defense systems.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the 10AX032H1F34I1HG Arria 10 GX FPGA.