10AX032E4F29I3SG

The 10AX032E4F29I3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) provided in a 780‑BBGA FCBGA package for surface-mount assembly. It combines a high logic element count with substantial embedded RAM and flexible I/O to address midrange, performance-sensitive applications.

Arria 10 devices are architected for higher performance and improved power efficiency and target diverse markets including wireless, wireline, broadcast, computing and storage, medical, and military applications where FPGA-based acceleration, protocol bridging, and real-time processing are required.

Key Features

• Logic Capacity  320,000 logic elements for high-density programmable logic and complex finite-state machine and datapath implementations.
• Embedded Memory  21,040,128 total RAM bits to support large on-chip buffers, packet queues, and local data storage for deterministic processing.
• I/O and Package  360 user I/Os in a 780‑BBGA (FCBGA) package, enabling dense external connectivity in a compact surface-mount footprint (supplier package: 780‑FBGA, FC 29×29).
• Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C, suitable for industrial environments that require extended temperature capability.
• Low-Voltage Core  Core supply range of 870 mV to 980 mV, enabling design integration with low-voltage power architectures.
• Series Capabilities  Part of the Intel Arria 10 family, which includes features such as variable-precision DSP blocks, embedded memory blocks, clock networks and PLLs, and hard IP for high-speed serial protocols (as described in the Arria 10 device overview).
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Wireless infrastructure  Channel and switch cards, and remote radio head processing where programmable logic and DSP resources accelerate PHY and MAC functions.
• Wireline networking  Line cards and mux/ponders for 40G/100G systems using high-density logic and embedded memory for packet processing and aggregation.
• Broadcast and professional AV  Studio switching, video processing, and transport applications that require real-time data handling and protocol interfacing.
• Computing and storage acceleration  Server acceleration and flash-cache controllers leveraging on-chip logic and memory for low-latency data paths.
• Medical and defense systems  Diagnostic imaging processors, radar, and secure communications that benefit from deterministic, reconfigurable hardware in industrial temperature ranges.

Unique Advantages

• High logic density: 320,000 logic elements provide headroom for complex control, datapath, and protocol stacks without external ASICs.
• Significant on‑chip RAM: Over 21 million bits of embedded RAM reduce dependence on external memory for buffering and local data processing.
• Broad I/O in a compact package: 360 I/Os in a 780‑BBGA FCBGA package enable dense pinout and board-level integration while conserving PCB area.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Low-voltage core operation: 870–980 mV supply range aligns with modern low-power power-rail architectures for improved system power budgeting.
• Series ecosystem: As an Arria 10 GX device, it benefits from family-level features such as DSP blocks, clocking structures, and available hard IP described in the device overview.

Why Choose 10AX032E4F29I3SG?

The 10AX032E4F29I3SG positions itself as a high-capacity, industrial-grade FPGA option for midrange systems that require a balance of logic density, embedded memory, and extensive I/O in a compact surface-mount package. Its Arria 10 family heritage delivers architecture-level capabilities—DSP resources, configurable clocking, and on-chip memory—that simplify implementation of compute- and data-intensive functions.

This part is suited to engineering teams building networked, broadcast, compute-acceleration, or industrial-grade systems that need a reconfigurable platform with robust resources and legacy-supported device documentation. Its combination of capacity, temperature range, and compliance attributes supports longer product lifecycles and scalable designs.

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