10AX032E4F29E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,398 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E4F29E3LG – Arria 10 GX Field Programmable Gate Array (FPGA)
The 10AX032E4F29E3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) device implemented in a 780-ball FCBGA package for surface-mount applications. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and is designed for performance-sensitive, power-aware designs across communications, computing, and industrial applications.
This device combines high logic capacity, substantial embedded memory, and broad I/O support to address applications such as wireless and wireline infrastructure, broadcast and compute acceleration while operating across a supply range of 870 mV to 980 mV and an ambient temperature range of 0 °C to 100 °C.
Key Features
- Core Architecture Arria 10 GX family device built on 20 nm process technology, optimized for mid-range, high-performance FPGA applications as described in the Arria 10 device overview.
- Logic Capacity 320,000 logic elements provide substantial programmable logic resources for complex designs.
- Embedded Memory 21,040,128 total RAM bits for on-chip buffering, caches, and data-path storage.
- I/O and Packaging 360 I/O pins in a 780-ball BGA (FCBGA) package, supplier package specified as 780-FBGA, FC (29×29), supporting high-density board integration.
- Power Device supply operates from 870 mV to 980 mV, enabling designs targeted at optimized core voltage domains.
- Thermal and Grade Extended-grade device rated for operation from 0 °C to 100 °C, suitable for a wide range of commercial and industrial-influenced environments.
- Mounting and Compliance Surface-mount FCBGA package; RoHS compliant.
- Series-Level Capabilities Arria 10 family features described in the device overview include variable-precision DSP blocks, embedded memory blocks, clock networks with PLL sources, PCIe hard IP support, and low-power serial transceivers (series-level capabilities referenced from the Arria 10 device documentation).
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems leveraging the device’s logic and transceiver capabilities.
- Wireline and Optical Networking Line cards, muxponders, and transponders for 40G/100G applications where programmable logic and embedded memory accelerate packet and transport functions.
- Broadcast and Media Studio switches, video transport and processing systems that require flexible I/O and on-chip memory for buffering and format conversion.
- Compute and Storage Acceleration Server offload, flash cache, and cloud acceleration modules that use high logic density and DSP resources for data-path acceleration.
Unique Advantages
- High Logic Density: 320,000 logic elements enable complex, feature-rich FPGA implementations without external logic.
- Large On-Chip Memory: Over 21 million bits of embedded RAM reduce dependence on external memory for many buffering and caching needs.
- Broad I/O in a Compact Package: 360 I/Os in a 780-ball FCBGA (29×29) package support dense board-level connectivity while maintaining surface-mount assembly.
- Power-Optimized Core Operation: Supported core supply range of 870 mV–980 mV allows designs to target specific power-performance points.
- Series Feature Set: Arria 10 family capabilities—such as DSP blocks, transceiver channels, and PCIe hard IP—provide a versatile platform for protocol and data-path implementations (series-level features referenced from device documentation).
- Compliance and Mounting: RoHS-compliant, surface-mount FCBGA package suitable for modern assembly processes.
Why Choose 10AX032E4F29E3LG?
The 10AX032E4F29E3LG positions itself as a high-capacity, mid-range Arria 10 GX FPGA suitable for designs that require a balanced mix of logic resources, on-chip memory, and flexible I/O in a compact surface-mount package. Its extended-grade rating and documented series-level features make it a fit for communications, compute acceleration, and advanced signal-processing applications where performance and power efficiency are important design considerations.
Choosing this device provides access to the Arria 10 family ecosystem and documentation, enabling designers to scale implementations across related Arria 10 variants while relying on Intel-provided device information and design resources.
Request a quote or submit a purchase inquiry to check availability and lead times for the 10AX032E4F29E3LG. Our team can provide pricing and delivery information to support your project schedule.

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