10AX032E4F27I3SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA

Quantity 1,157 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E4F27I3SG – Arria 10 GX FPGA, 320,000 Logic Elements, 672-BBGA (FCBGA)

The 10AX032E4F27I3SG is an Intel® Arria® 10 GX field-programmable gate array (FPGA) in a 672-ball FCBGA package. Built on the Arria 10 device family architecture, it delivers a high logic density and embedded memory capacity suited for mid-range, performance-sensitive applications.

Typical use cases span wireless and wireline communications, broadcast and video processing, and compute/acceleration roles where a combination of large logic resources, substantial on-chip RAM, and high-density I/O are required. The device targets designs that need industrial-grade operating range and power-efficient FPGA implementation.

Key Features

  • Programmable Logic — 320,000 logic elements provide substantial capacity for complex digital functions and custom hardware acceleration.
  • Embedded Memory — 21,040,128 total RAM bits for buffering, FIFOs, and on-chip data storage to support memory-intensive designs.
  • I/O and Connectivity — 240 I/O pins support a wide range of external interfaces and board-level connectivity options.
  • Family-Level Transceiver & Interface Capabilities — Arria 10 family documentation describes support for high-speed serial transceivers, PCIe Gen1/2/3 Hard IP, and 10 Gbps Ethernet class interfaces for demanding link requirements.
  • Power and Voltage — Operates from 870 mV to 980 mV supply range, enabling designs that target the device’s specified core power domain.
  • Package & Mounting — 672-BBGA FCBGA (27 × 27 mm) surface-mount package suitable for compact, high-density system boards.
  • Industrial Grade — Qualified for an operating temperature range of −40 °C to 100 °C for industrial applications.
  • Standards and Compliance — RoHS compliant to meet regulatory environmental requirements.
  • Family Features — Arria 10 family includes features such as adaptive logic modules, variable-precision DSP blocks, clock networks with PLLs, and support for dynamic and partial reconfiguration as described in the device overview documentation.

Typical Applications

  • Wireless Infrastructure — Channel processing and remote radio head electronics that benefit from programmable logic density and on-chip memory for real-time signal processing.
  • Wireline & Optical Networking — Line cards, muxponders, and transponders that require high-density logic and high-speed serial interfaces.
  • Broadcast and Video Processing — Studio switches and video transport applications leveraging large on-chip RAM and logic for frame buffering and format conversion.
  • Compute & Acceleration — Server-side acceleration, flash cache controllers, and cloud compute functions that use programmable logic for specialized data-paths and offload engines.

Unique Advantages

  • High Logic Capacity: 320,000 logic elements enable consolidation of multiple functions and higher levels of hardware acceleration on a single device.
  • Substantial On-Chip Memory: Over 21 million RAM bits reduce reliance on external memory for many buffering and dataflow tasks, simplifying board design.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial environments with extended temperature requirements.
  • Compact High-Density Package: 672-ball FCBGA (27 × 27 mm) balances board area and routing density for space-constrained systems.
  • Family-Level Interface Support: Documented Arria 10 capabilities for PCIe and high-speed Ethernet-class links help accelerate implementation of high-throughput designs.
  • Regulatory Compatibility: RoHS compliance facilitates use in regulated markets and supports environmentally conscious designs.

Why Choose 10AX032E4F27I3SG?

The 10AX032E4F27I3SG positions itself as a high-density, industrial-grade FPGA option within the Intel Arria 10 family, combining 320,000 logic elements with multi-megabit on-chip RAM and extensive I/O. It is intended for engineers who need a programmable platform that supports complex data-paths, high I/O counts, and on-board memory while operating across industrial temperature ranges.

Choosing this device brings the advantages of the Arria 10 device family architecture—documented support for high-speed interfaces, configurable DSP and memory resources, and power optimization features—making it suitable for mid-range applications in communications, broadcast, and compute acceleration where long-term platform scalability and vendor-backed documentation are important.

Request a quote or submit a sales inquiry to discuss pricing, availability, and how the 10AX032E4F27I3SG can fit into your next design.

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