10AX032E4F27I3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,157 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E4F27I3SG – Arria 10 GX FPGA, 320,000 Logic Elements, 672-BBGA (FCBGA)
The 10AX032E4F27I3SG is an Intel® Arria® 10 GX field-programmable gate array (FPGA) in a 672-ball FCBGA package. Built on the Arria 10 device family architecture, it delivers a high logic density and embedded memory capacity suited for mid-range, performance-sensitive applications.
Typical use cases span wireless and wireline communications, broadcast and video processing, and compute/acceleration roles where a combination of large logic resources, substantial on-chip RAM, and high-density I/O are required. The device targets designs that need industrial-grade operating range and power-efficient FPGA implementation.
Key Features
- Programmable Logic — 320,000 logic elements provide substantial capacity for complex digital functions and custom hardware acceleration.
- Embedded Memory — 21,040,128 total RAM bits for buffering, FIFOs, and on-chip data storage to support memory-intensive designs.
- I/O and Connectivity — 240 I/O pins support a wide range of external interfaces and board-level connectivity options.
- Family-Level Transceiver & Interface Capabilities — Arria 10 family documentation describes support for high-speed serial transceivers, PCIe Gen1/2/3 Hard IP, and 10 Gbps Ethernet class interfaces for demanding link requirements.
- Power and Voltage — Operates from 870 mV to 980 mV supply range, enabling designs that target the device’s specified core power domain.
- Package & Mounting — 672-BBGA FCBGA (27 × 27 mm) surface-mount package suitable for compact, high-density system boards.
- Industrial Grade — Qualified for an operating temperature range of −40 °C to 100 °C for industrial applications.
- Standards and Compliance — RoHS compliant to meet regulatory environmental requirements.
- Family Features — Arria 10 family includes features such as adaptive logic modules, variable-precision DSP blocks, clock networks with PLLs, and support for dynamic and partial reconfiguration as described in the device overview documentation.
Typical Applications
- Wireless Infrastructure — Channel processing and remote radio head electronics that benefit from programmable logic density and on-chip memory for real-time signal processing.
- Wireline & Optical Networking — Line cards, muxponders, and transponders that require high-density logic and high-speed serial interfaces.
- Broadcast and Video Processing — Studio switches and video transport applications leveraging large on-chip RAM and logic for frame buffering and format conversion.
- Compute & Acceleration — Server-side acceleration, flash cache controllers, and cloud compute functions that use programmable logic for specialized data-paths and offload engines.
Unique Advantages
- High Logic Capacity: 320,000 logic elements enable consolidation of multiple functions and higher levels of hardware acceleration on a single device.
- Substantial On-Chip Memory: Over 21 million RAM bits reduce reliance on external memory for many buffering and dataflow tasks, simplifying board design.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial environments with extended temperature requirements.
- Compact High-Density Package: 672-ball FCBGA (27 × 27 mm) balances board area and routing density for space-constrained systems.
- Family-Level Interface Support: Documented Arria 10 capabilities for PCIe and high-speed Ethernet-class links help accelerate implementation of high-throughput designs.
- Regulatory Compatibility: RoHS compliance facilitates use in regulated markets and supports environmentally conscious designs.
Why Choose 10AX032E4F27I3SG?
The 10AX032E4F27I3SG positions itself as a high-density, industrial-grade FPGA option within the Intel Arria 10 family, combining 320,000 logic elements with multi-megabit on-chip RAM and extensive I/O. It is intended for engineers who need a programmable platform that supports complex data-paths, high I/O counts, and on-board memory while operating across industrial temperature ranges.
Choosing this device brings the advantages of the Arria 10 device family architecture—documented support for high-speed interfaces, configurable DSP and memory resources, and power optimization features—making it suitable for mid-range applications in communications, broadcast, and compute acceleration where long-term platform scalability and vendor-backed documentation are important.
Request a quote or submit a sales inquiry to discuss pricing, availability, and how the 10AX032E4F27I3SG can fit into your next design.

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