10AX032E4F27E3SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA

Quantity 346 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E4F27E3SG – Arria 10 GX FPGA, 320,000 logic elements, 21,040,128 RAM bits, 240 I/Os

The 10AX032E4F27E3SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672-ball FCBGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs designed for high-performance, power-efficient midrange applications.

This device combines a high logic element count and large embedded memory with a substantial I/O complement and industry-standard packaging, making it suitable for applications that require dense programmable logic, on-chip RAM, and flexible external interfacing within the specified supply and temperature ranges.

Key Features

  • Logic Capacity — 320,000 logic elements (cells) to implement complex programmable logic and custom accelerators.
  • On‑Chip Memory — 21,040,128 total RAM bits for large embedded data buffers, FIFOs, and memory-mapped designs.
  • I/O Count — 240 user I/Os to support broad peripheral and memory interfacing requirements.
  • Package and Mounting — 672-BBGA (FCBGA), supplier device package 672-FBGA, FC (27×27); surface-mount mounting type for board-level integration.
  • Power Supply Range — Core voltage supply range from 870 mV to 980 mV, enabling operation within the specified device power envelope.
  • Operating Temperature — Extended grade operation from 0°C to 100°C for deployment in a wide range of environments.
  • Series-Level Capabilities — Features described in the Arria 10 device overview include variable-precision DSP blocks, embedded memory block types and configurations, comprehensive clock networks with PLLs, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems that require significant programmable logic and on-chip memory.
  • Wireline Communications — Line cards, muxponders and transponders (40G/100G) and aggregation or bridging applications leveraging PCIe and high-speed serial features described for the Arria 10 family.
  • Broadcast and Video Processing — Studio switching, transport and professional audio/video tasks that benefit from large RAM capacity and flexible I/O.
  • Computing and Storage — Flash cache, cloud server acceleration and server offload functions that use dense logic and embedded memory for acceleration logic.
  • Medical and Defense Electronics — Diagnostic imaging, radar, electronic warfare, and secure communications where programmable logic density and on-chip memory are required within the specified thermal and power envelope.

Unique Advantages

  • High Logic Density: 320,000 logic elements enable implementation of sophisticated custom logic and hardware acceleration without external ASICs.
  • Large Embedded Memory: Over 21 million RAM bits provide substantial on-chip buffering and storage for datapath, packet, and streaming designs.
  • Robust I/O and Packaging: 240 user I/Os in a 672-ball FCBGA (27×27) package support dense board-level integration and multiple external interfaces.
  • Family-Level IP and Transceivers: Arria 10 device features include PCIe hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers to simplify high-speed interface implementation.
  • Power and Thermal Range: Defined core supply (870 mV–980 mV) and extended-grade operating temperature (0°C–100°C) allow predictable integration into power- and temperature-constrained systems.
  • Regulatory and Manufacturing Readiness: Surface-mount FCBGA packaging and RoHS compliance support standard electronics manufacturing flows.

Why Choose 10AX032E4F27E3SG?

The 10AX032E4F27E3SG positions itself as a high-capacity Arria 10 GX FPGA option combining substantial logic resources, extensive embedded RAM, and a large I/O complement in a 672-ball FCBGA package. It is suited to midrange applications that need programmable performance, significant on-chip memory, and support for high-speed interfaces described within the Arria 10 device family documentation.

For design teams and procurement professionals targeting solutions that require dense programmable logic, integrated memory, and family-level transceiver and IP support, this device offers a clear, specification-driven option backed by the Arria 10 device overview and supporting documentation.

Request a quote or submit an RFQ to initiate pricing and availability details for the 10AX032E4F27E3SG.

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