10AX032E4F27E3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA |
|---|---|
| Quantity | 346 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E4F27E3SG – Arria 10 GX FPGA, 320,000 logic elements, 21,040,128 RAM bits, 240 I/Os
The 10AX032E4F27E3SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672-ball FCBGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs designed for high-performance, power-efficient midrange applications.
This device combines a high logic element count and large embedded memory with a substantial I/O complement and industry-standard packaging, making it suitable for applications that require dense programmable logic, on-chip RAM, and flexible external interfacing within the specified supply and temperature ranges.
Key Features
- Logic Capacity — 320,000 logic elements (cells) to implement complex programmable logic and custom accelerators.
- On‑Chip Memory — 21,040,128 total RAM bits for large embedded data buffers, FIFOs, and memory-mapped designs.
- I/O Count — 240 user I/Os to support broad peripheral and memory interfacing requirements.
- Package and Mounting — 672-BBGA (FCBGA), supplier device package 672-FBGA, FC (27×27); surface-mount mounting type for board-level integration.
- Power Supply Range — Core voltage supply range from 870 mV to 980 mV, enabling operation within the specified device power envelope.
- Operating Temperature — Extended grade operation from 0°C to 100°C for deployment in a wide range of environments.
- Series-Level Capabilities — Features described in the Arria 10 device overview include variable-precision DSP blocks, embedded memory block types and configurations, comprehensive clock networks with PLLs, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems that require significant programmable logic and on-chip memory.
- Wireline Communications — Line cards, muxponders and transponders (40G/100G) and aggregation or bridging applications leveraging PCIe and high-speed serial features described for the Arria 10 family.
- Broadcast and Video Processing — Studio switching, transport and professional audio/video tasks that benefit from large RAM capacity and flexible I/O.
- Computing and Storage — Flash cache, cloud server acceleration and server offload functions that use dense logic and embedded memory for acceleration logic.
- Medical and Defense Electronics — Diagnostic imaging, radar, electronic warfare, and secure communications where programmable logic density and on-chip memory are required within the specified thermal and power envelope.
Unique Advantages
- High Logic Density: 320,000 logic elements enable implementation of sophisticated custom logic and hardware acceleration without external ASICs.
- Large Embedded Memory: Over 21 million RAM bits provide substantial on-chip buffering and storage for datapath, packet, and streaming designs.
- Robust I/O and Packaging: 240 user I/Os in a 672-ball FCBGA (27×27) package support dense board-level integration and multiple external interfaces.
- Family-Level IP and Transceivers: Arria 10 device features include PCIe hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers to simplify high-speed interface implementation.
- Power and Thermal Range: Defined core supply (870 mV–980 mV) and extended-grade operating temperature (0°C–100°C) allow predictable integration into power- and temperature-constrained systems.
- Regulatory and Manufacturing Readiness: Surface-mount FCBGA packaging and RoHS compliance support standard electronics manufacturing flows.
Why Choose 10AX032E4F27E3SG?
The 10AX032E4F27E3SG positions itself as a high-capacity Arria 10 GX FPGA option combining substantial logic resources, extensive embedded RAM, and a large I/O complement in a 672-ball FCBGA package. It is suited to midrange applications that need programmable performance, significant on-chip memory, and support for high-speed interfaces described within the Arria 10 device family documentation.
For design teams and procurement professionals targeting solutions that require dense programmable logic, integrated memory, and family-level transceiver and IP support, this device offers a clear, specification-driven option backed by the Arria 10 device overview and supporting documentation.
Request a quote or submit an RFQ to initiate pricing and availability details for the 10AX032E4F27E3SG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018