10AX032E3F29I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 38 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E3F29I2LG – Arria 10 GX FPGA, 320000 logic elements, 780‑BBGA FCBGA
The 10AX032E3F29I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780‑ball ball grid array (FCBGA) package. It combines high logic density, substantial on‑chip RAM, and flexible I/O counts to address midrange, performance‑sensitive applications.
As part of the Arria 10 device family, this device is positioned for markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where performance, power efficiency, and system integration are key design drivers.
Key Features
- Logic Capacity — 320,000 logic elements to implement complex programmable logic and custom functions.
- Embedded Memory — 21,040,128 total RAM bits for on‑chip data buffering, state storage, and memory‑mapped logic.
- I/O and Interfaces — 360 device I/O pins to support broad peripheral and external memory interfacing options.
- Package and Mounting — 780‑BBGA (FCBGA) package, supplier device package listed as 780‑FBGA, FC (29×29); surface mount mounting type for board‑level integration.
- Voltage Supply — Core supply range 0.870 V to 0.930 V to match system power rails and power‑management strategies.
- Operating Temperature — Industrial temperature range from −40 °C to 100 °C for deployments across varied thermal environments.
- RoHS Compliant — Meets RoHS requirements for environmentally conscious designs.
- Arria 10 Family Capabilities — Family‑level features include low‑power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for high‑speed Ethernet and Interlaken, and architecture elements such as adaptive logic modules and variable‑precision DSP blocks (as part of the Arria 10 device overview).
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and on‑chip memory.
- Wireline and Optical Networking — 40G/100G muxponders, transponders, and line cards using high‑speed serial interfaces and programmable logic for protocol handling.
- Broadcast and Pro AV — Studio switches and video processing paths where flexible I/O and embedded RAM support real‑time media handling.
- Computing and Storage — Server acceleration, flash cache, and cloud infrastructure tasks that benefit from programmable logic and substantial on‑chip RAM.
- Medical and Defense Electronics — Diagnostic imaging, radar, and secure communications applications operating across the device’s industrial temperature range.
Unique Advantages
- High Logic Density: 320,000 logic elements enable implementation of large, consolidated designs and reduce the need for multiple devices.
- Substantial On‑Chip RAM: 21,040,128 bits of RAM support data buffering, line‑rate packet processing, and stateful algorithms without immediate external memory dependence.
- Generous I/O Count: 360 I/O pins provide flexibility for connecting external memory, transceivers, and board peripherals.
- Industrial Temperature Grade: Specified for −40 °C to 100 °C operation, suitable for designs requiring extended temperature range performance.
- Compact, Surface‑Mount Package: 780‑BBGA (29×29) FCBGA packaging delivers high I/O and routing density in a board‑level friendly form factor.
- Low‑Voltage Core Operation: Core supply range of 0.870 V to 0.930 V supports modern power‑efficient system designs.
Why Choose 10AX032E3F29I2LG?
The 10AX032E3F29I2LG offers a balance of logic capacity, embedded memory, and I/O flexibility within the Arria 10 GX family framework. Its combination of 320,000 logic elements and over 21 million bits of RAM makes it suitable for midrange designs that demand programmable performance and substantial on‑chip resources.
Backed by the Arria 10 device family capabilities and Intel’s device documentation and ecosystem, this FPGA is a fit for engineering teams building wireless infrastructure, high‑speed networking, broadcast, compute acceleration, and other applications that require a configurable, industrial‑grade FPGA platform.
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