10AX032E3F29E2LG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA

Quantity 1,067 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E3F29E2LG – Arria 10 GX FPGA, 780‑BBGA FCBGA

The 10AX032E3F29E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780‑ball BGA package designed for mid‑range, performance‑sensitive applications. Built on the Arria 10 device family architecture, this part brings a combination of high logic density, sizeable embedded RAM, and broad I/O to applications that require flexible logic integration and high‑speed connectivity.

Typical markets addressed by the Arria 10 family include wireless infrastructure, wireline and broadcast equipment, computing and storage acceleration, medical imaging, and military and secure communications—where power efficiency and performance tradeoffs are important design considerations.

Key Features

  • Core Architecture  Arria 10 GX device architecture based on Intel's 20‑nm family; optimized for mid‑range, performance‑sensitive FPGA applications.
  • Logic Capacity  320,000 logic elements to implement complex custom logic, control, and datapath functions.
  • Embedded Memory  21,040,128 total RAM bits for on‑chip buffering, caches, and packet/stream processing.
  • I/O Density  360 general‑purpose I/O pins to support multi‑interface systems and external memory or peripheral connectivity.
  • Package and Mounting  780‑BBGA (FCBGA) package; supplier device package listed as 780‑FBGA, FC (29×29). Surface mount package for board‑level integration.
  • Power and Voltage  Core voltage range 0.870 V to 0.930 V to match system power domains and regulator designs.
  • Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for environments requiring wider thermal margins than commercial‑only parts.
  • Compliance  RoHS compliant.
  • Family‑Level Connectivity & IP  Arria 10 devices include support for high‑speed system IP such as PCIe Gen1/Gen2/Gen3 hard IP and 10 Gbps Ethernet/Interlaken‑capable PCS features (family feature set documented in the Arria 10 device overview).

Typical Applications

  • Wireless Infrastructure  Channel and switch cards, and mobile backhaul equipment that require high logic density and efficient on‑chip memory for real‑time signal processing.
  • Wireline Networking  40G/100G muxponders, transponders and line cards where on‑chip logic and I/O support complex packet handling and high‑speed serial interfaces.
  • Broadcast and Professional AV  Studio switches, video transport and conferencing equipment leveraging large embedded RAM and programmable logic for media processing.
  • Computing & Storage  Server offload, flash cache and accelerator functions that use dense logic and memory for low‑latency data paths.
  • Medical & Defense Systems  Diagnostic imaging and radar or guidance systems that need customizable logic, on‑chip memory, and extended temperature operation.

Unique Advantages

  • High integration density: 320,000 logic elements together with over 21 million RAM bits reduce the need for external logic and memory, simplifying BOM and board area.
  • Broad I/O capability: 360 I/O pins provide flexibility for interfacing to multiple peripherals, memory buses, and front‑end PHYs without extensive external multiplexing.
  • Family‑level connectivity: Arria 10 family hard IP for PCIe Gen1/2/3 and support for 10 Gbps Ethernet/Interlaken enable common high‑speed protocols required in networking and compute applications.
  • Power domain compatibility: Core voltage range of 0.870–0.930 V facilitates integration into regulated system power architectures.
  • Extended operating range: Extended grade and 0 °C to 100 °C operating temperature support deployments that require wider thermal margins than standard commercial parts.
  • RoHS compliant: Meets current lead‑free and environmental requirements for global manufacturing.

Why Choose 10AX032E3F29E2LG?

The 10AX032E3F29E2LG Arria 10 GX FPGA offers a balanced combination of logic capacity, embedded memory, and I/O density for designers building mid‑range, performance‑sensitive systems. Its Arria 10 family heritage brings documented support for high‑speed protocol IP and power‑efficiency enhancements described in the device overview, making it suitable for communications, broadcast, compute acceleration, and advanced imaging applications.

Choose this device when your design requires substantial on‑chip resources, extended temperature operation, and integration of high‑speed interfaces while maintaining a compact surface‑mount package footprint.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the 10AX032E3F29E2LG Arria 10 GX FPGA.

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