10AX032E3F27E2LG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA

Quantity 863 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E3F27E2LG – Arria 10 GX FPGA, 672‑BBGA FCBGA, 240 I/Os

The 10AX032E3F27E2LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 672‑ball FCBGA package. As part of the Arria 10 family of 20‑nm mid‑range FPGAs and SoCs, it targets performance‑sensitive, power‑aware designs across communications, broadcast, compute and other applications.

This device provides a high logic capacity and substantial on‑chip RAM, along with a broad I/O complement and package options suitable for surface‑mount assembly. It is offered in an extended grade with RoHS compliance and an operating range suited to many commercial and industrial use cases.

Key Features

  • Logic Capacity  Approximately 320,000 logic elements to implement complex programmable logic and control functions.
  • Embedded Memory  21,040,128 total RAM bits of on‑chip memory for buffering, packet processing, and local storage of intermediate data.
  • I/O and Package  240 general‑purpose I/Os in a 672‑BBGA (672‑FBGA, FC 27×27) surface‑mount package for dense board integration.
  • Power and Voltage  Supported core voltage range of 870 mV to 930 mV, enabling targeted power‑supply design for the FPGA core.
  • Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
  • Arria 10 Family Architecture  Built on the Arria 10 device architecture (20‑nm) offering power‑efficiency and family‑level features such as clock networks, PLLs, variable‑precision DSP blocks, embedded memory blocks, and serial transceiver technologies.
  • Integrated IP and Interfaces  Arria 10 devices include hard IP options referenced in the device family documentation, including PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers.
  • Configuration and Reliability Features  Family‑level support for dynamic and partial reconfiguration, SEU detection and correction, and power management capabilities as described in Arria 10 device documentation.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and on‑chip memory accelerate signal processing.
  • Wireline Networking  Muxponders, transponders and 100G line cards that leverage programmable interfaces and available hard IP for packet aggregation and line‑rate processing.
  • Broadcast and Media  Studio switches and transport equipment requiring flexible I/O mapping and deterministic processing for audio/video workflows.
  • Compute and Storage Acceleration  Flash cache, server acceleration and cloud server offloads that use large logic capacity and embedded RAM for low‑latency data paths.
  • Imaging and Diagnostic Systems  Medical diagnostic scanners and imaging equipment that benefit from high logic density and on‑chip memory for real‑time data handling.

Unique Advantages

  • High programmable capacity: 320,000 logic elements enable complex algorithm implementation and large‑scale integration on a single device.
  • Substantial on‑chip memory: 21,040,128 bits of RAM reduce the need for external memory in many buffering and processing tasks.
  • Flexible I/O and compact package: 240 I/Os in a 672‑ball FCBGA (27×27 mm supplier package) support dense board layouts and high‑pin‑count systems.
  • Arria 10 family features: Family‑documented support for DSP blocks, serial transceivers, PCIe and 10 Gbps Ethernet hard IP expedites integration of common high‑speed interfaces.
  • Power‑aware architecture: 20‑nm Arria 10 devices are described in family documentation as designed for power efficiency, with core voltage specified between 870 mV and 930 mV to support optimized power delivery.
  • Commercial‑to‑extended operating range: Extended grade and 0 °C to 100 °C operating temperature accommodate a wide range of environmental conditions.

Why Choose 10AX032E3F27E2LG?

The 10AX032E3F27E2LG brings significant programmable logic and memory resources in a compact 672‑ball FCBGA package, making it suitable for mid‑range designs that require a balance of performance, integration and power efficiency. As part of the Arria 10 family, it benefits from a documented set of architecture features—DSP blocks, embedded memory, PLL/clock networks and hardened interface IP—that streamline implementation of communications, compute and media applications.

This device is targeted at engineers and procurement teams who need a programmable, RoHS‑compliant FPGA with high logic density, substantial on‑chip RAM and a verified Arria 10 feature set. Its extended grade and specified voltage and temperature ranges support deployments across commercial and many industrial applications where these parametric requirements align with system needs.

Request a quote or submit a purchasing inquiry to receive availability, pricing and lead‑time information for the 10AX032E3F27E2LG.

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