10AX032E3F27E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA |
|---|---|
| Quantity | 863 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E3F27E2LG – Arria 10 GX FPGA, 672‑BBGA FCBGA, 240 I/Os
The 10AX032E3F27E2LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 672‑ball FCBGA package. As part of the Arria 10 family of 20‑nm mid‑range FPGAs and SoCs, it targets performance‑sensitive, power‑aware designs across communications, broadcast, compute and other applications.
This device provides a high logic capacity and substantial on‑chip RAM, along with a broad I/O complement and package options suitable for surface‑mount assembly. It is offered in an extended grade with RoHS compliance and an operating range suited to many commercial and industrial use cases.
Key Features
- Logic Capacity Approximately 320,000 logic elements to implement complex programmable logic and control functions.
- Embedded Memory 21,040,128 total RAM bits of on‑chip memory for buffering, packet processing, and local storage of intermediate data.
- I/O and Package 240 general‑purpose I/Os in a 672‑BBGA (672‑FBGA, FC 27×27) surface‑mount package for dense board integration.
- Power and Voltage Supported core voltage range of 870 mV to 930 mV, enabling targeted power‑supply design for the FPGA core.
- Thermal and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
- Arria 10 Family Architecture Built on the Arria 10 device architecture (20‑nm) offering power‑efficiency and family‑level features such as clock networks, PLLs, variable‑precision DSP blocks, embedded memory blocks, and serial transceiver technologies.
- Integrated IP and Interfaces Arria 10 devices include hard IP options referenced in the device family documentation, including PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers.
- Configuration and Reliability Features Family‑level support for dynamic and partial reconfiguration, SEU detection and correction, and power management capabilities as described in Arria 10 device documentation.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and on‑chip memory accelerate signal processing.
- Wireline Networking Muxponders, transponders and 100G line cards that leverage programmable interfaces and available hard IP for packet aggregation and line‑rate processing.
- Broadcast and Media Studio switches and transport equipment requiring flexible I/O mapping and deterministic processing for audio/video workflows.
- Compute and Storage Acceleration Flash cache, server acceleration and cloud server offloads that use large logic capacity and embedded RAM for low‑latency data paths.
- Imaging and Diagnostic Systems Medical diagnostic scanners and imaging equipment that benefit from high logic density and on‑chip memory for real‑time data handling.
Unique Advantages
- High programmable capacity: 320,000 logic elements enable complex algorithm implementation and large‑scale integration on a single device.
- Substantial on‑chip memory: 21,040,128 bits of RAM reduce the need for external memory in many buffering and processing tasks.
- Flexible I/O and compact package: 240 I/Os in a 672‑ball FCBGA (27×27 mm supplier package) support dense board layouts and high‑pin‑count systems.
- Arria 10 family features: Family‑documented support for DSP blocks, serial transceivers, PCIe and 10 Gbps Ethernet hard IP expedites integration of common high‑speed interfaces.
- Power‑aware architecture: 20‑nm Arria 10 devices are described in family documentation as designed for power efficiency, with core voltage specified between 870 mV and 930 mV to support optimized power delivery.
- Commercial‑to‑extended operating range: Extended grade and 0 °C to 100 °C operating temperature accommodate a wide range of environmental conditions.
Why Choose 10AX032E3F27E2LG?
The 10AX032E3F27E2LG brings significant programmable logic and memory resources in a compact 672‑ball FCBGA package, making it suitable for mid‑range designs that require a balance of performance, integration and power efficiency. As part of the Arria 10 family, it benefits from a documented set of architecture features—DSP blocks, embedded memory, PLL/clock networks and hardened interface IP—that streamline implementation of communications, compute and media applications.
This device is targeted at engineers and procurement teams who need a programmable, RoHS‑compliant FPGA with high logic density, substantial on‑chip RAM and a verified Arria 10 feature set. Its extended grade and specified voltage and temperature ranges support deployments across commercial and many industrial applications where these parametric requirements align with system needs.
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