10AX032E2F29I1HG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA

Quantity 1,102 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E2F29I1HG – Arria 10 GX FPGA (320,000 logic elements, 780‑BBGA)

The 10AX032E2F29I1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package. It delivers mid‑range, 20‑nm FPGA capability with a balance of high logic capacity, embedded memory, and I/O for demanding industrial applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, medical, and military systems, this device targets high‑performance, power‑sensitive designs that benefit from on‑chip memory, flexible I/O and series‑level capabilities like low‑power serial transceivers and dynamic reconfiguration described in the Arria 10 family overview.

Key Features

  • Logic Capacity  320,000 logic elements to implement large FPGA designs and complex algorithms.
  • Embedded Memory  21,040,128 total RAM bits for on‑chip buffering, caches, and custom memory structures.
  • I/O Density  360 I/O pins to support broad connectivity requirements for external peripherals and high‑speed interfaces.
  • Package & Mounting  780‑BBGA (FCBGA), supplier package 780‑FBGA (29×29); surface‑mount package suitable for automated PCB assembly.
  • Operating Range  Industrial grade operation from ‑40 °C to 100 °C, supporting deployment in temperature‑sensitive environments.
  • Supply Voltage  Core supply range of 870 mV to 980 mV for device power domains.
  • Arria 10 Series Capabilities  Series‑level features called out in the device overview include 20‑nm architecture, power management options, clock networks and PLL sources, dynamic and partial reconfiguration, variable‑precision DSP blocks, and low‑power serial transceiver support.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul where FPGA logic and on‑chip memory accelerate signal processing.
  • Wireline networking  40G/100G muxponders, transponders and line cards requiring programmable logic and flexible I/O connectivity.
  • Broadcast and professional AV  Studio switches, transport and video processing systems that leverage large logic capacity and embedded RAM for frame buffering and format conversion.
  • Computing & storage  Flash cache, server acceleration and cloud compute applications that use FPGA acceleration and on‑chip memory for latency‑sensitive workloads.
  • Medical and defense systems  Diagnostic imaging, radar and electronic warfare platforms that require industrial‑grade temperature operation and reconfigurable processing.

Unique Advantages

  • High logic and memory integration: 320,000 logic elements paired with over 21 million RAM bits lets you implement complex algorithms and large data paths on a single device, reducing external components.
  • Substantial I/O count: 360 I/O pins provide the connectivity needed for multi‑lane interfaces, memory buses and peripheral integration without multiple interface chips.
  • Industrial temperature rating: Rated from ‑40 °C to 100 °C for deployment in demanding environmental conditions common in industrial and communications equipment.
  • Compact, assembly‑friendly package: 780‑BBGA (29×29) surface‑mount package supports dense PCB layouts and standard manufacturing processes.
  • Series‑level system features: Arria 10 family capabilities such as power management, PLL clocking options, dynamic/partial reconfiguration and low‑power transceiver technologies provide design flexibility and power efficiency.

Why Choose 10AX032E2F29I1HG?

The 10AX032E2F29I1HG Arria 10 GX FPGA combines substantial logic capacity, on‑chip memory and a high I/O count in an industrial‑grade, surface‑mount 780‑BBGA package. It is suited to mid‑range systems that require a balance of performance and power efficiency while benefiting from the Arria 10 family’s configuration and power management features.

This device is ideal for engineers developing communications infrastructure, broadcast equipment, compute acceleration, medical imaging and defense electronics who need scalable FPGA resources, robust operating range, and integration that simplifies board‑level design and BOM count.

Request a quote or submit a pricing and availability inquiry to begin evaluating the 10AX032E2F29I1HG for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up