10AX032E2F29I1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,102 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E2F29I1HG – Arria 10 GX FPGA (320,000 logic elements, 780‑BBGA)
The 10AX032E2F29I1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package. It delivers mid‑range, 20‑nm FPGA capability with a balance of high logic capacity, embedded memory, and I/O for demanding industrial applications.
Designed for markets such as wireless, wireline, broadcast, computing and storage, medical, and military systems, this device targets high‑performance, power‑sensitive designs that benefit from on‑chip memory, flexible I/O and series‑level capabilities like low‑power serial transceivers and dynamic reconfiguration described in the Arria 10 family overview.
Key Features
- Logic Capacity 320,000 logic elements to implement large FPGA designs and complex algorithms.
- Embedded Memory 21,040,128 total RAM bits for on‑chip buffering, caches, and custom memory structures.
- I/O Density 360 I/O pins to support broad connectivity requirements for external peripherals and high‑speed interfaces.
- Package & Mounting 780‑BBGA (FCBGA), supplier package 780‑FBGA (29×29); surface‑mount package suitable for automated PCB assembly.
- Operating Range Industrial grade operation from ‑40 °C to 100 °C, supporting deployment in temperature‑sensitive environments.
- Supply Voltage Core supply range of 870 mV to 980 mV for device power domains.
- Arria 10 Series Capabilities Series‑level features called out in the device overview include 20‑nm architecture, power management options, clock networks and PLL sources, dynamic and partial reconfiguration, variable‑precision DSP blocks, and low‑power serial transceiver support.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul where FPGA logic and on‑chip memory accelerate signal processing.
- Wireline networking 40G/100G muxponders, transponders and line cards requiring programmable logic and flexible I/O connectivity.
- Broadcast and professional AV Studio switches, transport and video processing systems that leverage large logic capacity and embedded RAM for frame buffering and format conversion.
- Computing & storage Flash cache, server acceleration and cloud compute applications that use FPGA acceleration and on‑chip memory for latency‑sensitive workloads.
- Medical and defense systems Diagnostic imaging, radar and electronic warfare platforms that require industrial‑grade temperature operation and reconfigurable processing.
Unique Advantages
- High logic and memory integration: 320,000 logic elements paired with over 21 million RAM bits lets you implement complex algorithms and large data paths on a single device, reducing external components.
- Substantial I/O count: 360 I/O pins provide the connectivity needed for multi‑lane interfaces, memory buses and peripheral integration without multiple interface chips.
- Industrial temperature rating: Rated from ‑40 °C to 100 °C for deployment in demanding environmental conditions common in industrial and communications equipment.
- Compact, assembly‑friendly package: 780‑BBGA (29×29) surface‑mount package supports dense PCB layouts and standard manufacturing processes.
- Series‑level system features: Arria 10 family capabilities such as power management, PLL clocking options, dynamic/partial reconfiguration and low‑power transceiver technologies provide design flexibility and power efficiency.
Why Choose 10AX032E2F29I1HG?
The 10AX032E2F29I1HG Arria 10 GX FPGA combines substantial logic capacity, on‑chip memory and a high I/O count in an industrial‑grade, surface‑mount 780‑BBGA package. It is suited to mid‑range systems that require a balance of performance and power efficiency while benefiting from the Arria 10 family’s configuration and power management features.
This device is ideal for engineers developing communications infrastructure, broadcast equipment, compute acceleration, medical imaging and defense electronics who need scalable FPGA resources, robust operating range, and integration that simplifies board‑level design and BOM count.
Request a quote or submit a pricing and availability inquiry to begin evaluating the 10AX032E2F29I1HG for your next design.

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