10AX032E2F29E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,913 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E2F29E1SG – Arria 10 GX FPGA, 320,000 logic elements, 780‑BBGA
The 10AX032E2F29E1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 780‑BBGA (29×29) FCBGA package for surface-mount applications. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, designed for high-performance, power-sensitive applications across diverse markets.
Typical use cases for the Arria 10 family include wireless infrastructure, high-speed wireline interfaces, broadcast and media systems, computing and storage acceleration, and diagnostic imaging, where a combination of logic capacity, embedded memory, and high-density I/O are required.
Key Features
- High Logic Capacity — 320,000 logic elements provide substantial programmable resources for complex digital designs and system-level integration.
- Embedded Memory — 21,040,128 total RAM bits for on-chip buffering, caching, and packet processing functions.
- Extensive I/O — 360 general-purpose I/O pins to support wide external interface requirements.
- Power and Voltage — Supported core voltage range from 870 mV to 980 mV to match system power domains and regulator designs.
- Package and Mounting — 780‑BBGA FCBGA (29×29) package, surface-mount mounting type for compact board-level implementation.
- Operating Range and Grade — Extended grade with an operating temperature range of 0°C to 100°C and RoHS compliance.
- Family-Level System Features — Arria 10 family documentation highlights variable-precision DSP blocks, embedded memory block types, clock networks and PLL clock sources, PCIe hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
Typical Applications
- Wireless Infrastructure: Channel and switch cards in remote radio heads and mobile backhaul equipment benefiting from high logic density and embedded memory.
- Wireline Networking: 40G/100G muxponders, transponders, and line cards where high-speed serial interfaces and programmable logic are required.
- Broadcast and Pro AV: Studio switches, videoconferencing, and professional audio/video processing that leverage on-chip memory and flexible I/O.
- Computing and Storage Acceleration: Flash cache, cloud computing servers, and server acceleration tasks that need parallel processing and memory bandwidth.
- Medical and Imaging Systems: Diagnostic scanners and imaging equipment requiring deterministic processing and integration of custom logic functions.
Unique Advantages
- Large Programmable Capacity: 320,000 logic elements enable complex algorithm implementation, hardware acceleration, and system consolidation onto a single device.
- Substantial On‑Chip Memory: Over 21 million RAM bits support deep buffering, large lookup tables, and data-intensive processing without immediate reliance on external memory.
- High I/O Count: 360 I/O pins simplify board-level routing for multi-protocol interfaces and parallel buses.
- Optimized Power Envelope: Family-level power-saving technologies and a defined core voltage range (870 mV–980 mV) enable designers to balance performance and power consumption.
- Compact, Manufacturable Package: 780‑BBGA FCBGA (29×29) surface-mount package supports high-density PCB layouts and automated assembly.
- Extended Temperature Grade: Rated for 0°C to 100°C operation for applications requiring extended commercial temperature operation.
Why Choose 10AX032E2F29E1SG?
The 10AX032E2F29E1SG positions itself as a high-performance, power-conscious mid-range FPGA option within the Intel Arria 10 family. Its combination of 320,000 logic elements, over 21 million RAM bits, and 360 I/O pins makes it suitable for complex midrange designs that require on-chip memory, substantial logic capacity, and flexible interfacing.
Engineers designing wireless infrastructure, high-speed networking, broadcast systems, or computing accelerators will find the device’s package options, family-level features (including DSP capability, clocking resources, and serial/PCIe hard IP), and extended-grade operation aligned to demands for integration and long-term platform scalability.
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