10AX032E2F29E2SG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA

Quantity 675 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E2F29E2SG – Arria 10 GX FPGA, 780‑BBGA FCBGA

The 10AX032E2F29E2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 780‑ball BGA FCBGA package. It is a member of the Arria 10 device family, a 20‑nm mid-range FPGA architecture focused on performance and power efficiency for demanding embedded and communications designs.

Designed for midrange high-performance applications, this device combines high logic density, large on-chip RAM, and a broad I/O complement to address markets such as wireless and wireline communications, broadcast, computing and storage, and advanced instrumentation.

Key Features

  • Core logic — 320,000 logic elements provide substantial programmable capacity for complex digital designs and algorithm acceleration.
  • Embedded memory — 21,040,128 total RAM bits enable large on‑chip buffering, lookup tables, and deep FIFOs for memory‑centric designs.
  • I/O and package — 360 user I/Os in a 780‑BBGA FCBGA (29 × 29) package; surface-mount package suited for dense board layouts.
  • Power supply — Core voltage supply range from 870–980 mV to match system power-rail requirements.
  • Operating range — Extended grade operating temperature of 0°C to 100°C for use in many commercial and industrial environments.
  • Family-level silicon features — Arria 10 device overview includes adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, and low‑power serial transceivers (as described for the Arria 10 family).
  • High-speed protocol support (family) — Family documentation cites PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and support for low‑power serial transceivers and related PMA/PCS features.
  • Design flexibility (family) — Family features include dynamic and partial reconfiguration, SEU error detection and correction mechanisms, and incremental compilation flows to support complex development cycles.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless infrastructure — Channel cards, remote radio head control, and mobile backhaul processing where dense logic and on‑chip memory reduce external components.
  • Wireline and networking — Line cards, 40G/100G muxponders, and transponders leveraging hard IP and high-speed transceiver capabilities described for the Arria 10 family.
  • Broadcast and professional AV — Studio switches, video transport and processing systems that require flexible I/O mapping and large on‑chip RAM for buffering and frame processing.
  • Computing and storage — Server acceleration, flash cache, and cloud compute offload where programmable logic and DSP resources are used for custom algorithms.

Unique Advantages

  • High programmable capacity: 320,000 logic elements provide headroom for large state machines, custom accelerators, and complex control logic.
  • Significant on‑chip memory: Over 21 million RAM bits reduce dependence on external memory for many buffering and table lookup tasks.
  • Robust I/O and packaging: 360 I/Os in a compact 780‑BBGA FCBGA package simplifies board integration while supporting dense signal routing.
  • Optimized power envelope: Core supply range of 870–980 mV enables designs targeted at low-voltage system domains.
  • Extended operating temperature: 0°C to 100°C grade supports a wide range of commercial and light industrial deployments.
  • Proven family features: Arria 10 family-level capabilities such as PCIe hard IP, advanced clocking, DSP blocks, and partial reconfiguration give design teams flexible building blocks for accelerated development.

Why Choose 10AX032E2F29E2SG?

The 10AX032E2F29E2SG positions designers to deploy midrange, high-performance FPGA solutions that balance logic density, on‑chip memory, and a wide I/O complement in a compact BGA footprint. Its Arria 10 family heritage brings architectural features targeted at communications, broadcast, and compute acceleration tasks while maintaining a power-efficient 20‑nm design approach as described in the device overview.

This device is suited for development teams and procurement groups seeking a field‑programmable platform with substantial logic and memory resources, flexible I/O, and family-level support for high‑speed serial protocols and advanced design flows.

Request a quote or submit an inquiry to receive pricing and availability information for 10AX032E2F29E2SG and to discuss how this Arria 10 GX FPGA can fit your next design.

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