10AX032E2F29E1HG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA

Quantity 256 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E2F29E1HG – Arria 10 GX FPGA, 320,000 Logic Elements, 780‑BBGA (FCBGA)

The 10AX032E2F29E1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 780‑ball fine‑pitch BGA (FCBGA) package. It belongs to the 20‑nm Arria 10 device family and provides a balance of high logic capacity, embedded memory, and I/O density for mid‑range, power‑sensitive applications.

Designed for markets such as wireless infrastructure, wireline communications, broadcast, computing/storage, and medical and defense systems, this device targets high‑performance, power‑efficient designs that require substantial on‑chip RAM and flexible I/O in a compact surface‑mount package.

Key Features

  • Logic Capacity — 320,000 logic elements suitable for complex mid‑range FPGA designs and system integration.
  • Embedded Memory — 21,040,128 total RAM bits for on‑chip data buffering, storage and high‑throughput processing.
  • I/O Density — 360 user I/Os to support numerous external interfaces and memory connections.
  • Package & Mounting — 780‑BBGA FCBGA package (supplier package: 780‑FBGA, 29×29) in a surface‑mount form factor for compact board designs.
  • Power Supply — Core voltage range from 870 mV to 980 mV to match system power architectures.
  • Operating Conditions — Extended grade with an operating temperature range of 0 °C to 100 °C.
  • RoHS Compliance — Device is RoHS compliant.
  • Arria 10 Family Capabilities — Part of the Intel Arria 10 family which emphasizes higher performance and power efficiency on a 20‑nm process (device family features and documentation available through vendor materials).

Typical Applications

  • Wireless Infrastructure — Channel and switch cards, remote radio head functions and mobile backhaul equipment that require programmable logic and on‑chip memory.
  • Wireline Communications — 40G/100G muxponder and transponder line cards, aggregation and bridging systems leveraging dense I/O and embedded RAM.
  • Broadcast and Professional AV — Studio switching, transport and video processing where deterministic logic, buffering and high I/O count are needed.
  • Computing & Storage — Flash cache, server acceleration and cloud compute offload functions that benefit from large logic and memory resources.
  • Medical & Defense Systems — Diagnostic imaging, radar and electronic warfare subsystems that utilize programmable logic for algorithm acceleration and system integration.

Unique Advantages

  • Substantial Logic Resources: 320,000 logic elements enable integration of large custom logic blocks and complex algorithms on a single device, reducing external component count.
  • Large On‑Chip RAM: Over 21 million RAM bits provide significant internal buffering and memory bandwidth for data‑intensive processing and low‑latency applications.
  • High I/O Count: 360 I/Os support multiple parallel interfaces and external memory connections without immediate need for I/O expansion.
  • Compact, Surface‑Mount Package: 780‑BBGA (29×29) FCBGA delivers high pin density in a compact footprint suitable for space‑constrained PCB layouts.
  • Tunable Power Envelope: Core supply range of 870 mV–980 mV allows system designers to align FPGA core power with platform power rails for optimized efficiency.
  • Extended Grade Operating Range: Rated for 0 °C to 100 °C operation to meet many commercial and industrial application environments.

Why Choose 10AX032E2F29E1HG?

The 10AX032E2F29E1HG positions itself as a feature‑dense Arria 10 GX FPGA offering a combination of large logic capacity, substantial embedded RAM and extensive I/O in a compact 780‑ball FCBGA package. Its 20‑nm Arria 10 heritage emphasizes performance and power efficiency, making it suitable for mid‑range designs that require significant on‑chip resources without moving to higher‑end device families.

This device is appropriate for design teams building wireless, wireline, broadcast, compute/storage, or advanced embedded systems that need scalable logic, abundant RAM, and robust I/O in a surface‑mount form factor. Support materials and device documentation from the Arria 10 family provide guidance for integration, configuration and power management during development.

Request a quote or submit a product inquiry to receive pricing, availability and lead‑time information for 10AX032E2F29E1HG.

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