10AX032E2F27I1HG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA

Quantity 404 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E2F27I1HG – Arria 10 GX FPGA, 672-BBGA (27×27)

The 10AX032E2F27I1HG is an Intel Arria 10 GX field programmable gate array (FPGA) IC built on a 20 nm mid-range architecture. It delivers a balance of high logic density, embedded memory, and configurable I/O for performance- and power-sensitive designs across communications, broadcast, and compute markets.

Designed for mid-range applications, this device combines 320,000 logic elements with extensive on-chip RAM and a compact 672-BBGA FCBGA package to support high-performance data processing, protocol acceleration and advanced interface integration.

Key Features

  • Core Logic  320,000 logic elements provide substantial programmable resources for complex digital designs and custom acceleration.
  • Embedded Memory  Total RAM capacity of 21,040,128 bits to support large buffering, caches, and on-chip data structures.
  • I/O and Package  240 user I/O pins in a 672-BBGA FCBGA package (supplier package: 672-FBGA, 27×27) to support dense external connectivity while maintaining a compact board footprint.
  • Transceivers and Connectivity  Arria 10 family features include integrated transceiver technology and hard IP such as PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet support as part of the device series capabilities.
  • Power and Voltage  Core supply voltage range 0.870 V to 0.980 V, reflecting low-voltage operation for power-sensitive designs; the family also emphasizes power-saving technologies.
  • Reliability and Temperature Range  Industrial-grade operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
  • Design Flexibility  Family-level features include clock networks, PLL clock sources, and support for dynamic and partial reconfiguration to enable flexible, field-updatable systems.
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable acceleration and adaptable I/O.
  • Wireline Transport  40G/100G muxponders, transponders and line cards where protocol processing and high-speed connectivity are required.
  • Broadcast and Pro AV  Studio switches, video transport and professional audio/video processing that need real-time signal handling and flexible interfacing.
  • Computing and Storage  Server acceleration, flash-cache controllers and cloud-compute functions where on-chip logic and embedded memory reduce data-path latency.

Unique Advantages

  • High logic and memory capacity: 320,000 logic elements combined with 21,040,128 bits of on-chip RAM enable substantial algorithm and buffer integration on a single device.
  • Compact, high-density packaging: 672-BBGA FCBGA (27×27) provides a small footprint for designs that demand a large number of I/O and logic resources without large PCB area penalties.
  • Industrial temperature range: Rated for −40 °C to 100 °C operation, allowing deployment in a wide range of environmental conditions.
  • Low-voltage core operation: 0.870–0.980 V supply supports power-sensitive designs and complements the Arria 10 family’s power-efficiency features.
  • Integrated connectivity IP: Family-level support for PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet hard IP accelerates protocol implementation and reduces development time.
  • Field-updatable architecture: Support for dynamic and partial reconfiguration enables in-field updates and design iteration without full device reprogramming.

Why Choose 10AX032E2F27I1HG?

The 10AX032E2F27I1HG places a high-capacity Arria 10 GX FPGA into a compact 672-BBGA package suited for mid-range, performance-sensitive applications. With 320,000 logic elements, over 21 million bits of embedded RAM and 240 I/O, it supports demanding data-path processing, protocol offload, and interface-intensive roles while operating across an industrial temperature range.

Choose this device when your design requires a balance of programmable logic density, on-chip memory, configurable I/O and family-level connectivity IP to accelerate development and enable long-term scalability within the Arria 10 ecosystem.

If you’d like pricing, availability, or a formal quote for 10AX032E2F27I1HG, request a quote or submit an inquiry to our sales team and we will assist promptly.

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