10AX032E2F27E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA |
|---|---|
| Quantity | 563 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E2F27E1SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 672-BBGA
The 10AX032E2F27E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 672-ball BGA (FCBGA) package for surface-mount applications. Built on the Arria 10 device family architecture, this 20 nm mid-range FPGA balances high performance and power efficiency for compute- and connectivity-focused designs.
Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and military applications. The device combines a large logic capacity, embedded memory, DSP capabilities and high-speed I/O to address functional integration and performance needs across these segments.
Key Features
- Logic Capacity — 320,000 logic elements providing substantial programmable resource density for complex control, signal processing, and protocol logic.
- Embedded Memory — 21,040,128 total RAM bits enabling on-chip buffering, packet storage, and tightly coupled data paths.
- I/O and Packaging — 240 I/O pins and a 672-BBGA (672-FBGA, 27×27 mm) surface-mount package to support dense board-level integration and multi-standard interfacing.
- Transceivers and Interfaces — Arria 10 GX family features low-power serial transceivers and hard IP for PCIe Gen1/Gen2/Gen3 and other high-speed protocols (series-level capability from device overview).
- DSP and Compute Blocks — Variable-precision DSP blocks and adaptive logic modules for efficient implementation of signal processing, filtering, and acceleration functions (series-level capability from device overview).
- Power Supply Range — Specified core voltage range of 870 mV to 980 mV to match board power rails and power-management schemes.
- Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C suitable for demanding commercial and communications environments.
- Standards and Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul solutions using programmable logic and DSP resources.
- Wireline Networking — 40G/100G muxponders, transponders and line cards where high-speed serial I/O and protocol hard IP are required.
- Broadcast and Media — Studio switches, video transport and professional audio/video processing leveraging embedded memory and DSP blocks.
- Compute and Storage — Server acceleration, flash cache and cloud compute offload functions relying on high logic density and on-chip memory.
- Medical and Defense Systems — Diagnostic imaging, radar and electronic warfare subsystems that require a blend of processing performance and integration.
Unique Advantages
- High Logic Density: 320,000 logic elements allow substantial on-chip integration of control, protocol and datapath functions, reducing external component count.
- Large On-Chip Memory: Over 21 million bits of RAM support extensive buffering and local data storage for latency-sensitive designs.
- Broad Interface Support: 240 I/Os and Arria 10 family transceiver and protocol hard IP capabilities enable complex multi-protocol systems and high-speed connectivity.
- Power-Optimized Operation: Core voltage window (870 mV–980 mV) and Arria 10 series power technologies help designers implement efficient power schemes.
- Surface-Mount, High-Density Package: 672-ball FCBGA (27×27 mm) simplifies board layout for high-pin-count applications while supporting automated assembly.
- Extended Grade Reliability: Specified for 0 °C to 100 °C operation and RoHS compliance for deployment in commercial and communications environments.
Why Choose 10AX032E2F27E1SG?
The 10AX032E2F27E1SG Arria 10 GX FPGA delivers a balanced combination of logic capacity, embedded memory and high-speed I/O in a compact 672-BBGA package. Its feature set is aimed at designs that require programmable compute and protocol acceleration—such as networking, wireless infrastructure, media processing and compute acceleration—where on-chip integration and power efficiency matter.
Designers benefit from a platform that scales across mid-range FPGA requirements while offering the integration needed to reduce BOM, consolidate functionality, and accelerate time to market. The extended-grade device and RoHS compliance make it suitable for a wide range of commercial and communications applications.
Request a quote or submit an inquiry today to get pricing and availability for 10AX032E2F27E1SG and to discuss how this Arria 10 GX FPGA can fit into your next design.

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