10AX032E2F27E1SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA

Quantity 563 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E2F27E1SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 672-BBGA

The 10AX032E2F27E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 672-ball BGA (FCBGA) package for surface-mount applications. Built on the Arria 10 device family architecture, this 20 nm mid-range FPGA balances high performance and power efficiency for compute- and connectivity-focused designs.

Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and military applications. The device combines a large logic capacity, embedded memory, DSP capabilities and high-speed I/O to address functional integration and performance needs across these segments.

Key Features

  • Logic Capacity — 320,000 logic elements providing substantial programmable resource density for complex control, signal processing, and protocol logic.
  • Embedded Memory — 21,040,128 total RAM bits enabling on-chip buffering, packet storage, and tightly coupled data paths.
  • I/O and Packaging — 240 I/O pins and a 672-BBGA (672-FBGA, 27×27 mm) surface-mount package to support dense board-level integration and multi-standard interfacing.
  • Transceivers and Interfaces — Arria 10 GX family features low-power serial transceivers and hard IP for PCIe Gen1/Gen2/Gen3 and other high-speed protocols (series-level capability from device overview).
  • DSP and Compute Blocks — Variable-precision DSP blocks and adaptive logic modules for efficient implementation of signal processing, filtering, and acceleration functions (series-level capability from device overview).
  • Power Supply Range — Specified core voltage range of 870 mV to 980 mV to match board power rails and power-management schemes.
  • Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C suitable for demanding commercial and communications environments.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul solutions using programmable logic and DSP resources.
  • Wireline Networking — 40G/100G muxponders, transponders and line cards where high-speed serial I/O and protocol hard IP are required.
  • Broadcast and Media — Studio switches, video transport and professional audio/video processing leveraging embedded memory and DSP blocks.
  • Compute and Storage — Server acceleration, flash cache and cloud compute offload functions relying on high logic density and on-chip memory.
  • Medical and Defense Systems — Diagnostic imaging, radar and electronic warfare subsystems that require a blend of processing performance and integration.

Unique Advantages

  • High Logic Density: 320,000 logic elements allow substantial on-chip integration of control, protocol and datapath functions, reducing external component count.
  • Large On-Chip Memory: Over 21 million bits of RAM support extensive buffering and local data storage for latency-sensitive designs.
  • Broad Interface Support: 240 I/Os and Arria 10 family transceiver and protocol hard IP capabilities enable complex multi-protocol systems and high-speed connectivity.
  • Power-Optimized Operation: Core voltage window (870 mV–980 mV) and Arria 10 series power technologies help designers implement efficient power schemes.
  • Surface-Mount, High-Density Package: 672-ball FCBGA (27×27 mm) simplifies board layout for high-pin-count applications while supporting automated assembly.
  • Extended Grade Reliability: Specified for 0 °C to 100 °C operation and RoHS compliance for deployment in commercial and communications environments.

Why Choose 10AX032E2F27E1SG?

The 10AX032E2F27E1SG Arria 10 GX FPGA delivers a balanced combination of logic capacity, embedded memory and high-speed I/O in a compact 672-BBGA package. Its feature set is aimed at designs that require programmable compute and protocol acceleration—such as networking, wireless infrastructure, media processing and compute acceleration—where on-chip integration and power efficiency matter.

Designers benefit from a platform that scales across mid-range FPGA requirements while offering the integration needed to reduce BOM, consolidate functionality, and accelerate time to market. The extended-grade device and RoHS compliance make it suitable for a wide range of commercial and communications applications.

Request a quote or submit an inquiry today to get pricing and availability for 10AX032E2F27E1SG and to discuss how this Arria 10 GX FPGA can fit into your next design.

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