10AX032E1F29E1SG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA

Quantity 1,413 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E1F29E1SG – Arria 10 GX FPGA, 780‑BBGA

The 10AX032E1F29E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780‑ball BGA (FCBGA) package. It combines a high logic element count with large on‑chip RAM and extensive I/O to address midrange, performance‑sensitive applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, medical and defense, the device emphasizes performance and power efficiency, while supporting advanced system features such as dynamic and partial reconfiguration and embedded hard IP blocks for high‑speed connectivity.

Key Features

  • Core & logic density 320,000 logic elements provide substantial programmable resources for complex digital signal processing and custom logic implementations.
  • On‑chip memory 21,040,128 total RAM bits of embedded memory to support large buffering, caching, and state storage without external memory in many designs.
  • I/O and high‑speed interfaces 360 I/O pins and device series features that include PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers.
  • Reconfiguration and reliability Supports dynamic and partial reconfiguration workflows and includes SEU (single‑event upset) error detection and correction mechanisms described in the device overview.
  • Power and process Built on a power‑efficient 20‑nm device architecture; voltage supply range specified at 870 mV to 980 mV to match system power domains.
  • Package & mounting 780‑BBGA (FCBGA) package, supplier device package 780‑FBGA (29×29), surface mount mounting type for compact board integration.
  • Temperature & grade Extended grade operation from 0 °C to 100 °C for a wider commercial operating window.

Typical Applications

  • Wireless infrastructure Radio head channel processing and mobile backhaul functions where programmable logic and embedded memory enable complex signal processing.
  • Wireline networking Line cards, muxponders and transponders that leverage high‑speed serial interfaces, PCIe hard IP and large on‑chip buffering for aggregation and transport tasks.
  • Broadcast and media Video/audio processing, studio switching and transport systems that require deterministic logic, large RAM and flexible I/O mapping.
  • Computing and storage acceleration Flash cache controllers, server acceleration and cloud compute offload use cases that benefit from high logic density and embedded memory.

Unique Advantages

  • High programmable capacity: 320,000 logic elements enable implementation of large, complex designs without immediate partitioning across multiple devices.
  • Substantial on‑chip memory: Over 21 million RAM bits reduce dependence on external memory for buffering and state retention, simplifying board design.
  • High‑speed connectivity: Built‑in hard IP for PCIe and enhanced PCS for Ethernet/Interlaken plus serial transceivers streamline integration of industry‑standard links.
  • Flexible integration: 360 I/Os and a compact 780‑ball FCBGA package support diverse board layouts and high‑density system designs.
  • Power‑aware architecture: Device family emphasis on power efficiency and a defined supply voltage window (870–980 mV) enable predictable power management.
  • Design robustness: Support for dynamic and partial reconfiguration plus SEU error detection and correction improves uptime and enables in‑field updates.

Why Choose 10AX032E1F29E1SG?

The 10AX032E1F29E1SG positions itself as a capable midrange FPGA option for designers who need a balance of logic capacity, embedded memory and high‑speed I/O in a compact surface‑mount package. Its feature set addresses common needs in communications, media and compute acceleration where programmable flexibility and power efficiency are important.

With extended‑grade operation and integrated system features such as hard IP for high‑speed links and reconfiguration support, the device offers a scalable foundation for products that require long product lifecycles and ongoing firmware evolution.

Request a quote or submit a procurement inquiry to get pricing, availability and delivery details for 10AX032E1F29E1SG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up