10AX032E1F27I1HG

The 10AX032E1F27I1HG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672-ball FBGA package intended for mid-range, performance-sensitive designs. It combines a 20 nm architecture with substantial programmable logic, embedded memory, and high-density I/O to address applications across wireless, wireline, broadcast, computing, medical, and defense markets.

Key on-package specifications include 320,000 logic elements, 21,040,128 total RAM bits, 240 general-purpose I/O pins, industrial-grade operation, and a supply range of 870 mV to 980 mV—features that support high-integration board designs and industrial operating environments.

Key Features

• 20 nm Device Family  Arria 10 devices are described as 20 nm mid-range FPGAs and SoCs offering higher performance and improved power efficiency compared with prior mid-range generations.
• Logic Capacity  320,000 logic elements provide substantial programmable resources for complex mid-range designs.
• Embedded Memory  21,040,128 total RAM bits of on-chip memory to support buffering, caching, and on-chip data structures.
• I/O and Package  240 I/O pins in a 672-BBGA (672-FBGA, 27×27) package for dense board-level integration and routing flexibility.
• Power and Thermal  Supply voltage range from 870 mV to 980 mV; rated operating temperature range from −40 °C to 100 °C for industrial deployment.
• Mounting and Compliance  Surface-mount package and RoHS compliance for standard PCB assembly and environmental compliance.
• Built-in IP and Reconfiguration  Device overview references integrated IP and capabilities such as PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, low-power serial transceivers, and support for dynamic and partial reconfiguration.

Typical Applications

• Wireless infrastructure  Channel cards, switch cards, and mobile backhaul systems can leverage the logic density and transceiver features for protocol processing and high-speed interfaces.
• Wireline networking  Line cards, muxponders, and transponders (including 40G/100G use cases) benefit from high logic and embedded memory capacity for packet processing and aggregation.
• Broadcast and AV systems  Studio switches, conferencing, and professional audio/video equipment can use the device for routing, format conversion, and timing-critical processing.
• Computing and storage  Server acceleration, flash cache, and cloud infrastructure modules can exploit on-chip memory and reconfiguration features for acceleration and caching tasks.
• Medical and defense systems  Diagnostic imaging, radar, electronic warfare, and secure communications where industrial temperature operation and reconfigurable logic are required.

Unique Advantages

• High logic and memory density: 320,000 logic elements and over 21 million RAM bits enable complex mid-range designs without external logic proliferation.
• Power-efficient 20 nm architecture: Device family positioning emphasizes improved power efficiency for performance-sensitive applications.
• Industrial operating range: Rated from −40 °C to 100 °C, supporting deployments in demanding environmental conditions.
• Dense I/O and package options: 240 I/O in a 672-FBGA (27×27) footprint for compact, high-density board layouts.
• Integrated protocol and reconfiguration support: On-device hard IP for PCIe and high-speed Ethernet, plus support for dynamic and partial reconfiguration to adapt designs in the field.
• Assembly and regulatory readiness: Surface-mount packaging and RoHS compliance simplify manufacturing and environmental compliance.

Why Choose 10AX032E1F27I1HG?

The 10AX032E1F27I1HG positions itself as a high-capacity, industrial-grade Arria 10 GX FPGA suited for mid-range applications that require a balance of logic density, embedded memory, and protocol IP. Its 20 nm architecture and integrated feature set support designs that need in-field reconfiguration, high-speed interfaces, and robust thermal operation.

This part is appropriate for engineering teams building network infrastructure, compute acceleration modules, broadcast systems, and industrial devices where on-chip memory, substantial logic resources, and reliable operation across −40 °C to 100 °C are critical considerations.

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