10AX032E1F29I1HG

The 10AX032E1F29I1HG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780‑FBGA (29×29) surface-mount package. It combines a high logic element count with on-chip RAM and broad I/O to address mid-range, performance‑ and power‑sensitive FPGA applications.

As part of the Arria 10 family of 20 nm devices, this FPGA is designed for applications requiring a balance of performance and power efficiency across markets such as wireless, wireline, broadcast, computing and storage, medical, and military systems.

Key Features

• Logic Capacity  320,000 logic elements provide substantial programmable fabric for complex custom logic and control functions.
• LAB/CLB Count  119,900 LABs/CLBs suitable for partitioning large designs and supporting parallel processing architectures.
• On‑Chip Memory  21,040,128 total RAM bits for embedded data buffering, frame storage, and deterministic memory resources.
• I/O Resources  360 device I/Os delivered via a 780‑FBGA package to support wide external interfacing and multi‑lane I/O configurations.
• Power Supply Range  Core voltage range 870 mV to 980 mV for compatibility with system power rails and power‑optimization strategies.
• Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Package & Mounting  780‑FBGA (29×29) surface‑mount package for compact board integration and high I/O density.
• Series‑Level Capabilities  Arria 10 device family features such as variable‑precision DSP blocks, embedded memory configurations, clock networks with PLLs, PCIe hard IP, and low‑power serial transceivers as documented for the Arria 10 family.
• Compliance  RoHS compliant, meeting common environmental directives for electronic components.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and power efficiency are required.
• Wireline Networking  40G/100G muxponders, transponders and line cards that require high logic capacity and embedded memory for packet processing and aggregation.
• Broadcast & Video  Studio switches, professional audio/video processing and transport applications leveraging on‑chip RAM and DSP resources for real‑time media handling.
• Computing & Storage  Server acceleration, flash cache and cloud computing server functions where FPGA offload and deterministic logic are valuable.
• Medical & Defense Systems  Diagnostic imaging, radar and electronic warfare subsystems that benefit from high logic density and extended operating temperature range.

Unique Advantages

• High logic density: 320,000 logic elements enable integration of large functions and multi‑channel designs without excessive external CPLDs or FPGAs.
• Substantial embedded memory: Over 21 million bits of on‑chip RAM reduce external memory dependencies and improve deterministic data handling.
• Flexible I/O footprint: 360 I/Os in a 780‑FBGA package provide the routing capacity needed for multi‑lane interfaces and dense peripheral connectivity.
• Industrial temperature range: Rated for −40 °C to 100 °C to support deployment in demanding thermal environments.
• Power‑aware operation: Core voltage range and Arria 10 family power technologies allow designers to optimize performance versus power consumption.
• Family ecosystem: Leverages Arria 10 family features such as DSP blocks, clocking resources and serial transceiver capabilities for system‑level integration.

Why Choose 10AX032E1F29I1HG?

The 10AX032E1F29I1HG positions itself as a high‑capacity, mid‑range FPGA option for engineers who need a balanced combination of programmable logic, embedded memory, and extensive I/O in a compact surface‑mount package. Its Arria 10 heritage brings series‑level features such as DSP blocks, PLL clocking, and serial transceiver technologies that help streamline system design.

This part is well suited for designers targeting wireless and wireline infrastructure, high‑performance compute acceleration, broadcast processing, and mission‑critical systems that require both logic density and an extended operating temperature range. Its specifications support scalable designs and long‑term deployment where power efficiency and integration are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for the 10AX032E1F29I1HG. Our team can provide lead‑time details and support for your procurement and design planning.