10AX027H4F35I3SG

The 10AX027H4F35I3SG is an Arria 10 GX field-programmable gate array (FPGA) device in a 1152-BBGA FCBGA package. Built on the Arria 10 device family architecture, this part targets mid-range, high-performance applications that require substantial logic capacity, embedded memory, and broad I/O.

Designed for industrial-grade deployments, the device combines 270,000 logic elements with 17,870,848 bits of on-chip RAM and 384 I/O to support demanding wireless, wireline, broadcast, computing and other system-level applications where integration and power-aware performance are important.

Key Features

• Core Architecture  The device is part of the Arria 10 family of 20 nm mid-range FPGAs, delivering the architecture and feature set associated with the Arria 10 GX variant.
• Logic Capacity  Approximately 270,000 logic elements to implement complex digital logic, custom datapaths, and control functions.
• Embedded Memory  17,870,848 total RAM bits of on-chip memory to support buffers, FIFOs, and embedded storage for high-throughput designs.
• I/O and Interfaces  384 device I/O signals for wide connectivity and system interfacing in dense applications.
• Power Supply  Operates from a core voltage range of 870 mV to 980 mV, enabling power-optimized system designs.
• Packaging and Mounting  1152-BBGA (FCBGA) supplier device package 1152-FBGA, FC (35 × 35) in a surface-mount form factor for board-level integration.
• Temperature and Grade  Industrial grade operation with an ambient range of −40 °C to 100 °C for deployment in harsher environments.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment that require dense logic and embedded memory to implement custom processing.
• Wireline Networking  40G/100G muxponders, transponders and line cards where sizeable logic capacity and wide I/O are needed for high-bandwidth packet processing and protocol handling.
• Broadcast and Media  Studio switches, video processing, and transport equipment that benefit from on-chip memory and programmable logic for flexible signal processing chains.
• Computing and Storage  Flash cache acceleration and server acceleration tasks that use embedded RAM and programmable logic to implement custom acceleration kernels.

Unique Advantages

• High logic density: 270,000 logic elements enable implementation of large custom logic functions and complex datapaths without immediate reliance on external ASICs.
• Substantial on-chip memory: 17,870,848 bits of embedded RAM reduce external memory dependency for buffering and accelerate in-line processing.
• Wide connectivity: 384 I/O pins provide flexible interfacing options for high-pin-count system designs and multi-channel applications.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in temperature-stressed environments.
• Power-optimized core: Core voltage operation between 870 mV and 980 mV supports low-voltage, power-aware system architectures.
• Surface-mount, compact package: 1152-BBGA (35 × 35 mm) packaging simplifies board-level integration while preserving high I/O and thermal handling characteristics.

Why Choose 10AX027H4F35I3SG?

The 10AX027H4F35I3SG positions itself as a mid-range Arria 10 GX FPGA that balances high logic capacity, significant embedded memory, and broad I/O in an industrial-grade package. It is well suited for system designers who need programmable flexibility, substantial on-chip resources, and operation across a wide temperature range.

For projects that require a combination of performance, integration, and power-aware operation—such as networking line cards, wireless infrastructure modules, broadcast processing units, and compute accelerators—this device provides the core building blocks to implement and scale complex FPGA-based solutions.

Request a quote or submit an RFQ today to evaluate the 10AX027H4F35I3SG for your next design.