10AX027H4F35E3LG

The 10AX027H4F35E3LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) offered in a 1152‑ball FCBGA package. It is part of the Arria 10 device family of 20‑nm mid‑range FPGAs that target high‑performance, power‑sensitive applications.

With 270,000 logic elements, 17,870,848 bits of embedded RAM and 384 I/O pins, this device addresses markets such as wireless and wireline communications, broadcast, computing and storage, medical imaging, and military systems where integrated logic, memory and I/O density are required.

Key Features

• Core Capacity  270,000 logic elements provide substantial programmable logic resources for complex digital designs and custom accelerators.
• Embedded Memory  17,870,848 total RAM bits for on‑chip buffering, LUTRAM and user memory requirements.
• I/O Density  384 general-purpose I/O pins to support wide external connectivity and parallel interfaces.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, FC 35×35) designed for surface‑mount assembly.
• Core Voltage  Supported supply range from 870 mV to 980 mV to match target core power rails.
• Operating Temperature  Rated for 0 °C to 100 °C operation (Extended grade) for environments within that range.
• Device Family Integration  Part of the Intel Arria 10 family; device documentation and family resources are available in the Arria 10 device literature.

Typical Applications

• Wireless infrastructure  Channel and switch cards used in remote radio heads and mobile backhaul benefit from the device's logic and memory capacity for signal processing and protocol handling.
• Wireline and optical networking  Line cards, muxponders and transponders for 40G/100G applications leverage the FPGA's integration of logic, memory and I/O density.
• Broadcast and professional AV  Studio switches, transport and video processing systems can use the device for routing, format conversion and buffering tasks.
• Computing and storage  Cloud servers and flash‑cache accelerators can use the device for custom offload logic and data buffering enabled by its embedded RAM.
• Medical and defense systems  Diagnostic imaging, radar and secure communications implementations can utilize the device's programmable resources and extended temperature rating.

Unique Advantages

• High programmable logic density: 270,000 logic elements enable complex custom designs and parallel processing architectures.
• Significant on‑chip memory: Nearly 18 Mbits of embedded RAM simplifies buffering and reduces dependence on external memory for many designs.
• Robust I/O complement: 384 I/O pins allow broad external interfacing and multiple simultaneous high‑pin count connections.
• Compact FCBGA packaging: 1152‑BBGA (35×35) package delivers the device density required for space‑constrained PCBs while supporting surface‑mount assembly.
• Low‑voltage core operation: 870–980 mV supply range aligns with modern low‑power core rails to support power‑sensitive designs.
• Extended temperature grade: Rated 0 °C to 100 °C for deployment in applications that require operation across typical commercial and extended environmental conditions.

Why Choose 10AX027H4F35E3LG?

The 10AX027H4F35E3LG positions itself as a high‑capacity Arria 10 GX FPGA option for mid‑range systems that require a balance of logic density, embedded memory and plentiful I/O in a compact FCBGA footprint. Its specifications suit designs in communications, broadcast, computing, medical and defense markets that demand programmable flexibility and on‑chip resources.

As a member of the Intel Arria 10 family, this device is supported by the device documentation and resources that accompany the family, enabling designers to integrate it into scalable architectures and leverage existing design flows and reference material.

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