10AX027H4F34I3SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA

Quantity 961 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027H4F34I3SG – Arria 10 GX FPGA, 270000 logic elements, 384 I/O, 1152-BBGA

The 10AX027H4F34I3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) optimized for mid-range, high-performance, power-sensitive applications. It is part of the Arria 10 family of 20 nm devices and combines large logic and memory resources with flexible I/O and package options for system-level integration.

Targeted at communications, broadcast, computing, medical and military markets, this industrial-grade device delivers a balance of performance and energy efficiency suitable for demanding embedded and infrastructure designs.

Key Features

  • Core Architecture – Arria 10 GX device from Intel’s 20 nm mid-range FPGA family, designed for higher performance and improved power efficiency compared with previous generations.
  • Logic Resources – 270,000 logic elements to implement complex digital functions and custom accelerators.
  • Embedded Memory – 17,870,848 total RAM bits, supporting large on-chip buffers and memory structures.
  • I/O and Interface Support – 384 I/O pins for broad connectivity. Series-level features include PCIe Gen1/Gen2/Gen3 hard IP, Interlaken support, and 10 Gbps Ethernet support as documented for Arria 10 devices.
  • High-speed Serial – Series-level capability for low-power serial transceivers and multiple transceiver channels to support high-bandwidth links.
  • DSP and Clocking – Variable-precision DSP blocks and extensive clock network features including PLL clock sources and fractional synthesis (series-level descriptions in the device overview).
  • Power and Voltage – Power-efficient device family with a specified core voltage supply range of 870 mV to 980 mV.
  • Package and Mounting – 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA, FC (35x35). Surface-mount mounting type.
  • Operating Range and Compliance – Industrial grade device with an operating temperature range of −40°C to 100°C and RoHS compliance.

Typical Applications

  • Wireless infrastructure – Channel and switch cards in remote radio heads and mobile backhaul equipment where performance and power efficiency are required.
  • Wireline transport – 40G/100G muxponders, transponders and line cards for bridging and aggregation applications leveraging high-speed serial links.
  • Broadcast and professional A/V – Studio switches, video transport and conferencing systems that require large on-chip memory and flexible I/O.
  • Computing and storage – Flash cache, server acceleration and cloud computing server applications that benefit from programmable acceleration and large logic/memory resources.
  • Medical and defense – Diagnostic imaging, radar and secure communications applications that need industrial temperature range and robust FPGA resources.

Unique Advantages

  • High logic density: 270,000 logic elements provide the headroom to implement complex signal processing, control, and compute functions on-chip.
  • Substantial embedded memory: 17,870,848 total RAM bits enable large on-chip buffers, frame storage, and lookup tables without external memory for many use cases.
  • Broad connectivity: 384 I/O pins and Arria 10 series interface hard IP (PCIe, Ethernet, Interlaken) simplify integration with high-speed networks and host systems.
  • Power-optimized platform: Built on a 20 nm architecture with documented power-saving technologies and a defined core supply range (870 mV–980 mV) to support power-sensitive designs.
  • Industrial operating range: Rated for −40°C to 100°C and supplied in a surface-mount 1152-BBGA/1152-FBGA package for rugged system deployment.
  • Standards and compliance: RoHS compliance supports regulatory requirements for electronics manufacturing and deployment.

Why Choose 10AX027H4F34I3SG?

The 10AX027H4F34I3SG Arria 10 GX FPGA combines a high logic element count, extensive embedded memory, and a large I/O complement within an industrial-grade, surface-mount BBGA package. It is positioned for mid-range designs that demand a balance of compute capability, memory capacity, and interface flexibility while addressing power-sensitive requirements through a documented 20 nm, power-efficient architecture.

Engineers and procurement teams can rely on this device for applications that need scalable programmability, robust thermal operating range, and compliance with RoHS. The Arria 10 device family-level features—such as DSP blocks, advanced clocking, and serial/transceiver capabilities—support a wide range of system-level designs across communications, computing, broadcast, medical, and defense markets.

Request a quote or submit an inquiry for pricing and availability of 10AX027H4F34I3SG and our team will respond with details to support your design and procurement needs.

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