10AX027H4F34I3LG

The 10AX027H4F34I3LG is an Intel Arria 10 GX FPGA in a high-density 1152-ball FCBGA package. It combines a mid-range, 20 nm FPGA architecture with a large logic fabric, abundant embedded memory, and a broad set of device-level features suited for performance-sensitive, power-aware designs.

Targeted markets include wireless and wireline communications, broadcast and video, computing and storage, and industrial systems where reconfigurability, logic capacity, and robust thermal range are required.

Key Features

• Logic Capacity — 270,000 logic elements providing a substantial programmable fabric for complex digital designs.
• Embedded Memory — 17,870,848 total RAM bits to support large buffering, packet processing, and on-chip data storage.
• High‑Density I/O & Package — 384 user I/O in a 1152‑ball FCBGA package (supplier package: 1152‑FBGA, FC, 35×35 mm) for dense board-level routing and system integration.
• Industrial Temperature Grade — Qualified for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Low‑Voltage Core — Core supply range of 870 mV to 980 mV enabling low-voltage operation and efficient power scaling.
• Advanced FPGA Architecture — Series-level capabilities include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock networks with PLLs, and support for dynamic and partial reconfiguration.
• High‑Speed Interfaces and IP — Device family features include hard IP options such as PCIe (Gen1/Gen2/Gen3), enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers (as described for the Arria 10 family).
• System Reliability & Management — Series-level features include SEU detection and correction mechanisms and power-management facilities to support resilient, long‑running systems.
• Mounting and Compliance — Surface-mount device with RoHS compliance for modern manufacturing and environmental standards.

Typical Applications

• Wireless Infrastructure — Channel processing, fronthaul/backhaul aggregation and remote radio head functions that require reconfigurable high-speed logic and DSP resources.
• Wireline & Optical Transport — 40G/100G line cards, muxponders/transponders, and aggregation equipment leveraging high-speed serial transceivers and protocol hard IP.
• Broadcast & Video Processing — Studio switching, video routing, and real‑time processing where embedded memory and massive logic count accelerate packet buffering and frame handling.
• Compute & Storage Acceleration — Server offload, flash cache controllers, and custom accelerators that benefit from rich DSP blocks and large on-chip RAM.

Unique Advantages

• Large programmable fabric: 270,000 logic elements enable complex system integration on a single device, reducing external logic and BOM count.
• Substantial on‑chip memory: Nearly 18 Mbits of embedded RAM supports deep buffering and on‑chip data structures for latency‑sensitive designs.
• Robust I/O and packaging: 384 I/O in a 1152‑ball FCBGA package provides high pin density for multi-channel systems and dense board layouts.
• Industrial operating range: −40 °C to 100 °C supports deployment in harsh or temperature‑varying environments common in infrastructure and industrial applications.
• Power-scalable core voltage: 870–980 mV core supply range allows designers to balance performance and power for energy-sensitive systems.
• Series-level system features: Built-in support for DSP, PLLs, serial transceivers, PCIe and Ethernet hard IP, and dynamic/partial reconfiguration help accelerate development and integration.

Why Choose 10AX027H4F34I3LG?

The 10AX027H4F34I3LG positions itself as a high-capacity, mid-range FPGA option that combines significant logic and memory resources with industrial-grade thermal tolerance and a low-voltage core. It is suitable for engineers building reconfigurable systems that demand on-chip memory, abundant I/O, and series-level IP and transceiver capabilities.

For projects that require scalable logic density, embedded RAM for packet or frame buffering, and resilient operation across a broad temperature range, this Arria 10 GX device provides a balance of integration and system-level features to shorten development cycles and consolidate functionality onto a single programmable device.

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