10AX027H3F35I2SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA

Quantity 729 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027H3F35I2SG – Arria 10 GX FPGA, 270,000 logic elements, 1152-BBGA

The 10AX027H3F35I2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152-BBGA (FCBGA) package. Built on the Arria 10 device family architecture, it targets high-performance, power-sensitive midrange applications across wireless, wireline, broadcast, computing, medical and defense markets.

This device combines high logic density, substantial embedded RAM and a broad set of system-level features from the Arria 10 family to support functions such as high-speed serial links, memory interfaces, DSP processing and complex system integration while operating across an industrial temperature range.

Key Features

  • Logic Capacity — 270,000 logic elements (Number Of Logic Elements Cells: 270000) and approximately 101,620 adaptive logic modules (Number Of Labs Clbs: 101620) for large-scale logic integration.
  • Embedded Memory — Total RAM capacity of 17,870,848 bits (Total Ram Bits: 17870848) to support on-chip buffering, caching and custom memory structures.
  • I/O Density — 384 I/O pins (Number Of Io: 384) to support wide external connectivity and multi-channel interfaces.
  • Power and Voltage — Core supply range specified at 870 mV to 930 mV (Voltage Supply: 870 mV to 930 mV), consistent with Arria 10 power domains and power-management strategies described in the device family documentation.
  • Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C (Operating Temperature: -40 C to 100 C; Grade: Industrial).
  • Package and Mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA, FC (35×35). Surface mount mounting type (Package Case: 1152-BBGA, FCBGA; Supplier Device Package: 1152-FBGA, FC (35x35); Mounting Type: Surface Mount).
  • Arria 10 Family System Features — Family-level features documented for Arria 10 include variable-precision DSP blocks, embedded memory block types and configurations, robust clock networks and PLL clock sources, PCIe Gen1/Gen2/Gen3 hard IP, and low-power serial transceivers for high-speed links.
  • Advanced Development Capabilities — Device family documentation describes capabilities such as dynamic and partial reconfiguration, SEU error detection and correction support, and incremental compilation to aid iterative hardware and software development.
  • Compliance — RoHS compliant (RoHS Status: Compliant).

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment, leveraging high logic density and embedded memory for baseband processing and control.
  • Wireline and Optical Networking — 40G/100G muxponders, transponders and 100G line cards where high-speed serial transceivers and PCIe hard IP support line-rate data handling and protocol offload.
  • Broadcast and Professional AV — Studio switches, transport and professional video applications that require flexible I/O, buffering, and timing management.
  • Computing and Storage — Server acceleration, flash cache, and cloud-compute offload functions that use on-chip RAM and DSP resources for data-path processing.
  • Medical and Defense Systems — Diagnostic imaging, radar, electronic warfare and secure communications benefiting from industrial temperature range and high integration density.

Unique Advantages

  • High Logic Density: 270,000 logic elements provide the capacity to implement complex RTL designs and custom accelerators on a single device.
  • Substantial On-Chip Memory: 17,870,848 bits of embedded RAM minimize external memory dependence for buffering and local storage.
  • Robust I/O Count: 384 I/O pins enable broad external connectivity for multi-channel interfaces and system expansion.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployments in demanding environmental conditions.
  • System-Level Feature Set: Arria 10 family capabilities such as variable-precision DSP blocks, PLL-based clocking, PCIe hard IP and low-power transceivers simplify high-performance system design.
  • Compact FCBGA Packaging: 1152-BBGA (35×35) surface-mount package offers a balance of I/O, thermal performance and PCB area efficiency for board-level integration.

Why Choose 10AX027H3F35I2SG?

The 10AX027H3F35I2SG places Arria 10 GX family capabilities into a compact, industrial-grade FCBGA package with high logic element count, large on-chip RAM and extensive I/O. It is positioned for designs that require a combination of compute density, flexible I/O and Arria 10 family system features such as DSP blocks, transceivers and PCIe hard IP.

Choose this device when your application requires scalable midrange FPGA performance with documented Arria 10 architecture features and industrial temperature operation, enabling robust designs across communications, broadcast, compute and specialized imaging or defense systems.

Request a quote or submit an inquiry to receive pricing, availability and assistance integrating 10AX027H3F35I2SG into your next design.

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