10AX027H3F35E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,141 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027H3F35E2LG – Arria 10 GX FPGA, 270,000 logic elements, 1152-BBGA
The 10AX027H3F35E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) device in a 1152-BBGA/FCBGA package, designed for mid-range, high-performance and power-efficient applications. Built around the Arria 10 family architecture, this device combines large logic capacity, substantial on-chip RAM, and flexible I/O to address demanding communications, computing, and signal-processing tasks.
Typical market segments documented for the Arria 10 family include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense systems—applications that benefit from the device’s 20 nm architecture, programmable DSP resources, and advanced I/O and configuration features.
Key Features
- Logic Capacity — 270,000 logic elements (cells) to implement complex digital logic and custom accelerators.
- On‑chip Memory — 17,870,848 total RAM bits of embedded memory for buffering, packet processing, and data staging.
- I/O Density — 384 general-purpose I/O pins for broad interface support and board-level connectivity.
- DSP and Signal Processing — Arria 10 family includes variable‑precision DSP blocks suitable for arithmetic- and signal-processing workloads.
- High‑speed Interfaces and IP — Device family documentation cites support for PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, plus low-power serial transceivers and transceiver channel features.
- Clocking and PLLs — Rich clock networks with fractional-synthesis and I/O PLL options to support complex timing domains.
- Configuration and Reliability — Family features include dynamic and partial reconfiguration, SEU error detection and correction, and enhanced configuration options referenced in the device overview.
- Package and Mounting — 1152-BBGA, FCBGA (supplier device package 1152-FBGA, FC 35×35), surface-mount device for compact board integration.
- Power and Thermal — Supported core voltage range 870 mV to 930 mV and operating temperature 0°C to 100°C; device grade listed as Extended.
- Family-Level System Options — Arria 10 family documentation references SoC with Hard Processor System capabilities and comprehensive power-management features for supported variants.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul designs that require programmable DSP and high I/O density.
- Wireline Networking — 40G/100G muxponders, transponders, and 100G line cards leveraging hard PCIe/PCS IP and high-speed serial transceivers.
- Broadcast and Media Processing — Studio switches, transport servers, and video processing where large on-chip RAM and DSP resources enable real-time data handling.
- Computing and Storage Acceleration — Flash cache, cloud server acceleration, and compute offload that benefit from dense logic and embedded memory.
- Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare applications that require programmable signal processing and reliability features.
Unique Advantages
- High logic density: 270,000 logic elements support large, complex designs and multiple concurrent functions on a single device.
- Substantial on‑chip RAM: Nearly 18 Mbits of embedded RAM reduces external memory dependence for buffering and low-latency data paths.
- Rich I/O and interface support: 384 I/O pins combined with family-level PCIe and high-speed transceiver IP provide flexible connectivity for networking and interface-rich systems.
- Compact, board-friendly package: 1152-BBGA surface-mount package (35×35 mm FC) enables high pin-count routing in limited board space.
- Power and thermal qualification: Defined core voltage range (870–930 mV) and 0°C to 100°C operating range with Extended grade help streamline system power and thermal planning.
- Configurability and reliability: Support for dynamic/partial reconfiguration and SEU detection/correction (documented at the family level) aids uptime and in-field flexibility.
Why Choose 10AX027H3F35E2LG?
The 10AX027H3F35E2LG Arria 10 GX device is positioned for engineers who need a balance of logic density, embedded memory, and flexible I/O in a compact FPGA package. Its family-level features—variable-precision DSP blocks, advanced clocking, high-speed interface IP, and configuration/reliability options—combine with the device’s specific resources (270,000 logic elements, 17,870,848 RAM bits, 384 I/O) to support demanding communications, compute acceleration, and signal-processing designs.
Choose this part when your design requires substantial on-chip resources, configurable high-speed interfaces, and a surface-mount BBGA package with defined power and temperature bounds. The Arria 10 family documentation provides additional architecture and integration guidance referenced for this device.
Request a quote or submit a parts inquiry to check pricing, availability, and lead times for 10AX027H3F35E2LG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018