10AX027H3F34E2LG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA

Quantity 921 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027H3F34E2LG – Arria 10 GX FPGA, 270,000 logic elements, 17,870,848 RAM bits, 384 I/O

The 10AX027H3F34E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-BBGA (FCBGA) package. It implements a mid-range 20 nm FPGA architecture designed for applications that require a balance of performance and power efficiency.

Typical markets for this device include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense systems. The device combines a high logic element count, substantial embedded memory, and a dense I/O complement to address complex system-level integration needs.

Key Features

  • Core Logic  270,000 logic elements provide programmable fabric for complex digital designs and custom logic implementation.
  • Embedded Memory  17,870,848 total RAM bits of on-chip memory to support buffering, packet processing, and algorithm acceleration.
  • I/O Capacity  384 general-purpose I/O pins for broad interfacing options with external devices, high-pin-count peripherals, and memory interfaces.
  • Package & Mounting  1152-BBGA (FCBGA) surface-mount package, supplier package listed as 1152-FBGA FC (35×35), enabling compact board-level integration.
  • Power Supply  Supported voltage supply range of 870 mV to 930 mV, permitting designs that target the device’s specified core operating window.
  • Operating Range & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployment in a wide set of commercial and industrial-adjacent environments.
  • Standards & Family Capabilities  Part of the Intel Arria 10 family, which includes device features such as power-saving technologies, fractional synthesis and I/O PLLs, PCIe hard IP, and support for high-speed serial protocols as described in the device overview.
  • Compliance  RoHS-compliant device supporting modern environmental requirements for lead-free manufacturing.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards, and mobile backhaul equipment where programmable logic and embedded memory are used for real-time signal processing and protocol offloading.
  • Wireline Communications  40G/100G muxponders, transponders, and line cards that benefit from the device’s logic density and I/O capacity for packet processing and line-rate data paths.
  • Broadcast & Media  Studio switches, video transport, and conferencing equipment that require deterministic processing and high-throughput buffering.
  • Computing & Storage  Flash cache acceleration and server offload applications leveraging on-chip memory and programmable logic for custom acceleration functions.
  • Medical & Defense Systems  Diagnostic imaging, radar, and electronic warfare subsystems that use the device’s logic resources and system-level features for signal conditioning and control.

Unique Advantages

  • High logic density: 270,000 logic elements enable complex algorithms and large-scale custom logic integration on a single device, reducing board-level component count.
  • Substantial on‑chip RAM: 17,870,848 bits of embedded memory support large buffers, lookup tables, and state storage for high-throughput designs.
  • Broad I/O connectivity: 384 I/O pins provide flexibility for interfacing to multiple high-speed peripherals and memory devices without extensive external glue logic.
  • Compact, manufacturable package: 1152-BBGA (FCBGA) surface-mount package with a 35×35 supplier footprint facilitates dense PCB layouts and automated assembly.
  • Designed for power-aware designs: Family-level power-saving technologies and a defined core voltage range (870 mV–930 mV) help manage power in performance-sensitive applications.
  • Extended operating range and RoHS compliance: 0 °C to 100 °C operating range and RoHS compliance align with demanding deployment environments and modern manufacturing requirements.

Why Choose 10AX027H3F34E2LG?

The 10AX027H3F34E2LG Arria 10 GX FPGA offers a balanced platform for designers who need significant programmable logic, plentiful embedded memory, and a high I/O count in a compact package. Its specification set supports mid-range, performance-sensitive applications across communications, broadcast, computing, medical, and defense markets.

Backed by Intel’s Arria 10 device documentation and family resources, this device is suitable for engineers seeking a scalable FPGA solution with clear performance and power parameters, supported by established device-level guidance and errata where applicable.

Request a quote or submit a purchasing inquiry to evaluate the 10AX027H3F34E2LG for your next design.

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