10AX027H3F34I2SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA

Quantity 1,874 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027H3F34I2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 270000 logic elements, 17870848 RAM bits, 384 I/Os, 1152-BBGA

The 10AX027H3F34I2SG is an Intel Arria 10 GX FPGA device built on the Arria 10 family architecture. It targets mid-range, high-performance, and power-sensitive applications with integrated programmable logic, on-chip memory, and advanced transceiver and I/O capabilities.

Typical market segments for this device include wireless and wireline communications, broadcast and media transport, computing and storage acceleration, medical imaging, and military and secure communications. The device combines dense logic and embedded memory with industry-standard I/O and packaging to support system-level integration and power-conscious designs.

Key Features

  • Core Logic  270,000 logic element cells provide substantial programmable logic capacity for mid-range digital designs.
  • Embedded Memory  17,870,848 total RAM bits for on-chip buffering, scratchpad storage, and memory-mapped logic functions.
  • I/O Density  384 user I/Os to support wide external interfacing and system connectivity requirements.
  • Transceivers and Interfaces  Family-level features include low-power serial transceivers and hard IP for PCIe Gen1/Gen2/Gen3, enhanced PCS for Interlaken and 10 Gbps Ethernet, and flexible external memory interface options as described in the Arria 10 device overview.
  • Power and Supply  Supported core voltage range from 870 mV to 930 mV, enabling designs optimized for power efficiency within the specified supply window.
  • Package and Mounting  1152-ball BGA package (FCBGA / 1152-FBGA, FC 35×35) for surface-mount PCB assembly and high-density board integration.
  • Operating Range  Industrial-grade operation from -40 °C to 100 °C, suitable for demanding temperature environments.
  • Configuration and Reliability  Arria 10 family features noted in the device overview include support for dynamic and partial reconfiguration, SEU error detection and correction, clock networks with PLLs, and power management capabilities.
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and I/O density enable protocol and processing flexibility.
  • Wireline and Optical Networking  40G/100G muxponders, transponders, and line cards leveraging embedded transceivers and hard IP for high-speed serial protocols.
  • Broadcast and Media  Studio switches, video transport and professional audio/video equipment that benefit from on-chip memory and configurable interfaces.
  • Compute Acceleration and Storage  Server acceleration, flash cache controllers, and cloud compute appliances using programmable logic and embedded memory for application-specific offload.
  • Imaging and Secure Systems  Medical diagnostic scanners and military applications requiring robust temperature range and reconfigurable logic for signal processing and secure communications.

Unique Advantages

  • High programmable capacity: 270,000 logic element cells provide room for complex algorithms, protocol engines, and system glue logic within a single FPGA device.
  • Substantial on-chip memory: 17,870,848 RAM bits reduce external memory dependence and accelerate data-path operations.
  • Rich I/O and transceiver set: 384 I/Os combined with family-level low-power transceivers and hard IP enable flexible system interfacing and high-speed connectivity.
  • Industrial temperature rating: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compact, assembly-ready package: 1152-ball FCBGA (35×35) package supports high-density PCB layouts and surface-mount manufacturing.
  • Power-aware operation: Documented device and family-level power management features and a defined core voltage window (870 mV–930 mV) support energy-conscious designs.

Why Choose 10AX027H3F34I2SG?

The 10AX027H3F34I2SG Arria 10 GX device positions itself as a versatile mid-range FPGA offering a blend of logic density, embedded memory, I/O capacity, and family-level high-speed interface support. It is suitable for engineers building communication systems, compute accelerators, and industrial-grade embedded applications that require reconfigurable logic and robust operating conditions.

Backed by Intel's Arria 10 device family documentation and on-chip capabilities such as dynamic reconfiguration, power management, and hardened interface IP, this device provides a scalable platform for development and long-term deployment where performance and integration are key considerations.

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