10AX027H2F35I2SG

The 10AX027H2F35I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in an industrial-grade surface-mount package. It combines a high logic element count and substantial on-chip memory with broad I/O capacity to address mid-range, performance-sensitive FPGA applications.

As part of the Arria 10 family, this device targets markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where performance and power efficiency are important considerations.

Key Features

• Core Logic — 270,000 logic elements providing high integration density for complex FPGA designs.
• Embedded Memory — 17,870,848 bits of on-chip RAM to support buffering, packet processing, and data-path implementations.
• I/O Capacity — 384 I/O pins to enable extensive external device and memory interfacing.
• Power Envelope — Specified core voltage supply range from 870 mV to 980 mV for core power planning and regulation design.
• Package & Mounting — 1152‑BBGA (supplier package: 1152‑FBGA, FC 35×35) surface-mount package for compact board-level integration.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Family Capabilities (Arria 10) — Device family features described in the Arria 10 overview include advanced DSP blocks, embedded memory blocks, configurable clock and PLL networks, and support for high-speed serial and protocol hard IP options for system-level design flexibility.
• Regulatory — RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel and switch cards or remote radio head logic where dense programmable logic and substantial on-chip RAM are needed for signal processing and control.
• Wireline and optical networking — Line cards, muxponders and transponders that benefit from large logic capacity and extensive I/O for packet handling and protocol interfacing.
• Broadcast and Pro AV — Video switching and transport functions that use embedded RAM and logic resources for frame buffering and format processing.
• Compute acceleration and storage — Server offload, flash cache, or accelerator tasks that leverage programmable logic and memory on a single device.
• Industrial and medical systems — Control, imaging, and diagnostic equipment requiring industrial temperature operation and high integration density.

Unique Advantages

• High integration density: 270,000 logic elements and large on-chip RAM reduce external component count and simplify board designs.
• Flexible I/O capability: 384 I/O pins support rich peripheral and memory interfaces for complex system interconnects.
• Industrial robustness: −40 °C to 100 °C operating range enables deployment in temperature-challenging environments.
• Compact package option: 1152‑BBGA (35×35 FC) surface-mount package supports high-density PCB layouts.
• Power-aware operation: Narrow core supply window (870–980 mV) facilitates precise power budgeting for power-sensitive designs.
• Series-level capabilities: As an Arria 10 device, it benefits from family features such as advanced DSP and memory architectures and configurable clocking to support diverse mid-range FPGA tasks.

Why Choose 10AX027H2F35I2SG?

The 10AX027H2F35I2SG balances substantial logic and memory resources with broad I/O and an industrial temperature rating, making it a strong option for mid-range systems that require performance and reliability. Its Arria 10 family heritage brings architecture-level capabilities—such as advanced DSP and embedded memory structures—useful for signal processing, networking, and compute-acceleration designs.

Choose this device when you need a high-density, industrial-grade FPGA platform that supports scalable designs, compact packaging, and controlled power delivery for long-term product deployments.

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