10AX027H3F34I2LG

The 10AX027H3F34I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) offered in a 1152‑BBGA (FCBGA) package. As part of the Arria 10 family, this device is built on a 20‑nm architecture and targets mid‑range designs that require a balance of performance and power efficiency.

With 270,000 logic elements, 17,870,848 bits of embedded RAM, and 384 I/O, the device is suited for demanding applications across wireless, wireline, broadcast, computing and storage, medical, and military market segments that are listed in the Arria 10 device overview.

Key Features

• Core Capacity — 270,000 logic elements provide substantial programmable logic for complex custom hardware functions and acceleration tasks.
• Embedded Memory — 17,870,848 total RAM bits of on‑chip memory support large buffering and data‑parallel processing requirements.
• I/O and Packaging — 384 I/O pins in a 1152‑BBGA (FCBGA) package with surface‑mount mounting for high‑density board integration; supplier device package listed as 1152‑FBGA, FC (35×35).
• Low‑voltage Core Supply — Core supply specified at 870 mV to 930 mV to match system power rails and enable power‑optimized designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Arria 10 Family Capabilities — Family‑level features include variable‑precision DSP blocks, adaptive logic modules, clock networks with PLL sources, PCIe Gen1/Gen2/Gen3 hard IP, low‑power serial transceivers, enhanced PCS hard IP for high‑speed interfaces, and support for dynamic and partial reconfiguration.
• Compliance — RoHS compliant to support regulated manufacturing and assembly requirements.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and DSP capability are needed.
• High‑Speed Networking — Line cards, muxponders and transponders for 40G/100G applications benefiting from embedded PCIe hard IP and high‑speed transceivers.
• Broadcast and Media — Studio switches, video transport, and professional audio/video processing that leverage on‑chip RAM and DSP resources.
• Compute and Storage Acceleration — Server offload, flash cache, and cloud acceleration tasks that require programmable logic density and memory bandwidth.
• Medical and Defense Systems — Diagnostic imaging, radar, electronic warfare, and secure communications where industrial temperature range and robust FPGA features are required.

Unique Advantages

• Balanced Performance and Efficiency: Arria 10 family architecture delivers high performance with power‑saving features for mid‑range applications.
• High Logic Density: 270,000 logic elements enable complex IP integration and hardware acceleration while reducing board‑level component count.
• Substantial On‑Chip Memory: Nearly 18 million bits of embedded RAM support deep buffering and parallel data processing without immediate reliance on external memory.
• Flexible High‑Speed Connectivity: Family support for PCIe Gen1/Gen2/Gen3 and low‑power serial transceivers simplifies implementation of high‑throughput interfaces.
• Industrial Reliability: −40 °C to 100 °C operating range and surface‑mount BBGA packaging suit deployment in industrial systems.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 10AX027H3F34I2LG?

The 10AX027H3F34I2LG combines the Arria 10 family’s 20‑nm architecture with a substantial logic and memory footprint to deliver a flexible FPGA platform for mid‑range, performance‑sensitive designs. Its combination of logic density, embedded RAM, and comprehensive family‑level features—such as DSP blocks, PLL clocking, PCIe hard IP, and high‑speed transceivers—makes it suitable for developers building network, compute, broadcast, medical, and defense systems.

Designed for industrial deployment with a broad operating temperature range and RoHS compliance, this device is aimed at teams that need a scalable, supported FPGA solution for long‑life projects where integration, power efficiency, and performance are key considerations.

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