10AX027H3F35I2LG

The 10AX027H3F35I2LG is an Intel Arria 10 GX FPGA in a 1152-ball FBGA package, optimized for mid-range, performance-sensitive designs. As a member of the Arria 10 device family, it is built on a 20 nm architecture and is described in the device overview as a high-performance, power-efficient FPGA/SoC option for a range of markets.

This device provides a combination of high logic density, substantial on-chip RAM, and extensive I/O that suits applications in wireless and wireline infrastructure, broadcast, computing and storage, medical devices, and defense systems that require industrial-grade temperature performance and RoHS compliance.

Key Features

• Core Logic 270,000 logic elements to implement complex digital functions and custom accelerators.
• Embedded Memory 17,870,848 total RAM bits of on-chip memory to support buffering, packet processing, and local data storage.
• I/O Capacity 384 I/O pins for flexible interfacing with high-density peripherals and memory subsystems.
• Package & Mounting 1152-ball FBGA package (1152-FBGA, FC, 35×35) with surface-mount assembly for compact board integration.
• Voltage Supply Core supply range 870 mV to 930 mV to match system power rails and profiling.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments; RoHS compliant.
• Arria 10 Family Capabilities Series-level features include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, and support for high-speed serial connectivity and standards referenced in the Arria 10 device overview.

Typical Applications

• Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable acceleration and I/O density are required.
• Wireline Networking Line cards, muxponders, and transponders for 40G/100G systems that benefit from programmable packet processing and embedded memory.
• Broadcast and Pro AV Video processing, studio switching, and transport applications that need real-time logic processing and memory buffering.
• Computing & Storage Server acceleration and flash-cache controllers that leverage high logic density and on-chip RAM for low-latency operations.

Unique Advantages

• High logic density: 270,000 logic elements enable complex designs and algorithm acceleration without external ASIC development.
• Substantial on-chip RAM: 17,870,848 RAM bits reduce dependence on external memory for buffering and fast local data access.
• Generous I/O: 384 I/Os provide flexible connectivity for multi-channel designs and high-speed interfaces.
• Industrial readiness: Rated from −40 °C to 100 °C and RoHS compliant for deployment in industrial environments.
• Compact BGA package: 1152-ball FBGA (35×35) balances PCB area and thermal/mechanical reliability for high-density boards.
• Power profile: Defined core supply range (870 mV–930 mV) supports predictable power budgeting in system designs.

Why Choose 10AX027H3F35I2LG?

The 10AX027H3F35I2LG Arria 10 GX FPGA brings series-level performance and power-efficiency from the Intel Arria 10 family together with device-specific resources—270,000 logic elements, nearly 18 million bits of embedded RAM, and 384 I/Os—in a compact 1152-FBGA package rated for industrial temperatures. This combination is suited to mid-range systems that require programmable throughput, memory capacity, and I/O flexibility without moving to custom silicon.

Engineers and procurement teams designing for wireless, wireline, broadcast, computing, medical, or defense-related applications can rely on the device’s integration, industrial temperature range, and RoHS compliance to deliver scalable designs with clear upgrade paths within the Arria 10 device family.

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