10AX027H4F34E3SG

The 10AX027H4F34E3SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152-ball FCBGA package. Built on a 20 nm mid-range FPGA architecture, the device combines high logic density, large embedded memory, and extensive I/O to address performance- and power-sensitive applications.

Targeted use cases include wireless and wireline communications, broadcast and video processing, compute and storage acceleration, and other mid-range applications that benefit from a balance of performance, integration, and power efficiency.

Key Features

• Core Logic  270,000 logic elements providing substantial programmable capacity for complex digital designs.
• Embedded Memory  17,870,848 total RAM bits for on-chip buffering, FIFOs, and data manipulation.
• I/O Count  384 user I/Os to support broad external connectivity and parallel interfaces.
• Process and Power  20 nm device family architecture with power-saving technologies; rated supply range 870 mV to 980 mV to support power-optimized operation.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplier package noted as 1152‑FBGA, FC (35×35); surface-mount mounting type for board-level integration.
• Operating Conditions  Extended grade operation from 0 °C to 100 °C, with RoHS compliance for environmental conformity.
• Series Capabilities (per device family)  Arria 10 family-level features include configurable DSP blocks, embedded memory types, flexible clock networks and PLLs, and serial transceiver and hard IP options suitable for high-speed interfaces.

Typical Applications

• Wireless Infrastructure  Channel and switch card designs, remote radio head processing, and mobile backhaul functions that require programmable logic and embedded memory.
• Wireline & Networking  Line cards, muxponders/transponders, and aggregation equipment where high-speed data handling and flexible I/O are needed.
• Broadcast & Media  Studio switching, video processing, and professional audio/video transport requiring low-latency processing and on-chip buffering.
• Compute & Storage  Server acceleration, flash-cache and cloud infrastructure elements that leverage programmable logic and high memory capacity.
• Imaging & Medical  Diagnostic imaging and scanner subsystems that use high-density logic and large embedded memory for real-time data processing.

Unique Advantages

• High Logic Density: 270,000 logic elements enable complex algorithm implementation and deep datapath designs without immediate need for external logic.
• Substantial On-Chip Memory: Nearly 18 Mb of embedded RAM supports large buffers, look-up tables, and in-line data manipulation, reducing external memory dependence.
• Generous I/O Resource: 384 I/Os accommodate multiple parallel interfaces and mixed-signal front ends, simplifying board-level integration.
• Power-Aware Operation: 20 nm architecture combined with a defined supply voltage range (870 mV–980 mV) supports designs focused on energy efficiency.
• Board-Level Integration Friendly: 1152‑ball FCBGA package and surface-mount construction facilitate compact, high-density PCB layouts.
• Extended Temperature Range: Rated for 0 °C to 100 °C operation to match mid-range commercial and extended-environment deployments.

Why Choose 10AX027H4F34E3SG?

The 10AX027H4F34E3SG delivers a balanced combination of programmable logic capacity, on-chip memory, and extensive I/O in a compact FCBGA package. Its place in the Arria 10 GX family brings device-level features such as advanced DSP blocks, flexible clocking, and hard IP options for high-speed interfaces, making it suitable for designers who need mid-range performance with attention to power and integration.

This device is well suited to engineers developing communications, media, compute, and imaging systems that demand significant on-chip resources, scalable design options, and vendor-supported device family capabilities.

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