10AX027H2F35E2SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA

Quantity 249 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027H2F35E2SG – Arria 10 GX FPGA (270,000 logic elements)

The 10AX027H2F35E2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA FCBGA package. It provides a mid-range, power-conscious FPGA architecture built for high-performance embedded and networked applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications, this device combines large logic capacity, significant embedded memory, and a broad I/O complement to support complex data-paths, packet processing, and system acceleration tasks.

Key Features

  • Logic Capacity — 270,000 logic elements to implement complex digital logic and control functions.
  • Embedded Memory — 17,870,848 total RAM bits for on-chip buffering, lookup tables, and state storage.
  • I/O and Packaging — 384 I/O pins in a 1152-BBGA (FCBGA) package, supplied as 1152-FBGA, FC (35×35) for high-density board integration; surface-mount mounting.
  • Transceiver and Interface Support — Device-level documentation references transceiver, PCS/PMA, and PCIe hard IP capabilities suitable for high-speed serial and protocol interfaces.
  • DSP and Arithmetic — Architecture includes variable-precision DSP resources for configurable signal processing and algorithm acceleration.
  • Clocking and PLLs — Integrated clock networks and PLL clock sources enable flexible timing architectures and fractional synthesis.
  • Power Supply Range — Core voltage supply range of 870 mV to 980 mV to support the device’s power domain requirements.
  • Operating Range and Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

  • Wireless infrastructure — Channel and switch card functions in remote radio heads and mobile backhaul equipment leveraging on-chip DSP and high logic density.
  • Wireline networking — 40G/100G muxponders, transponders, and line cards where high-speed serial interfaces and programmable packet processing are required.
  • Broadcast and professional AV — Studio switches and videoconferencing equipment using the device’s I/O and embedded memory for real-time media handling.
  • Compute and storage acceleration — Cloud and server acceleration tasks such as flash cache buffering and custom data-path offload using the FPGA’s RAM and logic resources.
  • Medical and defense systems — Diagnostic imaging, radar, and secure communications applications that benefit from flexible logic, DSP blocks, and integrated clocking.

Unique Advantages

  • Substantial on-chip resources: 270,000 logic elements and 17.87 Mbits of RAM provide headroom for complex algorithms and multi-function designs.
  • High-density I/O and package: 384 I/Os in a 1152-BBGA FCBGA package enable compact, high-pin-count board layouts for dense system integration.
  • Flexible timing and interface support: Integrated PLLs, clock networks, and documented hard IP for common serial protocols simplify high-speed interface design.
  • Designed for power-conscious designs: The device is positioned as power-efficient within its class and operates from a defined core voltage window of 870–980 mV.
  • Extended-grade reliability: Rated as Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance, supporting deployed systems in controlled environments.

Why Choose 10AX027H2F35E2SG?

The 10AX027H2F35E2SG offers a balanced mix of logic capacity, embedded memory, and interface capability in a compact FCBGA package, making it suitable for mid-range applications that demand programmability, on-chip data buffering, and flexible I/O. Its Arria 10 GX architecture and documented features such as configurable DSP resources, clocking fabrics, and serial interface hard IP provide designers with the building blocks to accelerate custom hardware functions and system integration.

This device is a fit for engineering teams developing network, broadcast, compute-acceleration, and specialized imaging or defense systems that require scalable logic and memory resources, along with vendor-supported device documentation and configuration options.

Request a quote or submit an inquiry to purchase the 10AX027H2F35E2SG and include your required quantity and board/package requirements for prompt assistance.

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