10AX027H2F35E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 900 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027H2F35E2LG – Arria 10 GX FPGA, 270,000 Logic Elements, 384 I/Os, 1152-BBGA
The 10AX027H2F35E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-BBGA (FCBGA) package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs that target applications requiring a balance of performance and power efficiency.
Designed for markets such as wireless infrastructure, wireline communications, broadcast, computing and storage, medical, and defense, this device delivers programmable logic, embedded memory, and high I/O density for complex, power-conscious system designs.
Key Features
- Logic Capacity 270,000 logic elements to implement complex custom logic and control functions.
- Embedded Memory 17,870,848 total RAM bits provide on‑chip storage for buffering, packet processing, and intermediate data structures.
- I/O Density 384 user I/Os support wide external interfacing and high pin-count connectivity for memory, transceivers, and peripherals.
- Package and Mounting 1152-BBGA, FCBGA (supplier package: 1152-FBGA, FC 35×35) surface-mount package for high-density board integration.
- Power and Voltage Core voltage supply range 870 mV to 980 mV, enabling operation within the Arria 10 core power envelope.
- Operating Range and Grade Extended grade with an operating temperature range of 0 °C to 100 °C; RoHS compliant.
- Arria 10 Family Capabilities Series-level features include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, PCIe Gen1/Gen2/Gen3 hard IP, and support for high-speed serial interfaces as described in the Arria 10 device overview.
- Configuration and Reconfiguration Supports dynamic and partial reconfiguration modes provided by the Arria 10 device architecture for flexible in-field updates (series-level capability).
Typical Applications
- Wireless Infrastructure Implements channel and switch cards or mobile backhaul functions where programmable DSP, logic capacity, and on‑chip memory are needed.
- Wireline Communications Supports 40G/100G muxponders, transponders, and line-card functions that require high I/O density and embedded memory for packet buffering.
- Broadcast and Media Enables studio switching, video processing, and transport applications that benefit from programmable logic and embedded memory.
- Compute and Storage Acceleration Useful for flash cache, cloud server acceleration, and other data-path offload roles leveraging logic, memory, and I/O bandwidth.
Unique Advantages
- Substantial Logic Resources: 270,000 logic elements allow implementation of large custom accelerators and complex control logic without external ASICs.
- Large On‑Chip Memory: Nearly 18 Mbits of embedded RAM reduce external memory dependence for buffering and state management, simplifying board-level memory architectures.
- High I/O Count: 384 I/Os provide flexibility for multi-channel interfaces, wide memory buses, and dense peripheral connectivity.
- Arria 10 Series Feature Set: Series-level support for DSP blocks, PLL-based clocking, PCIe hard IP, and serial interface technologies enables system-level integration consistent with mid-range FPGA requirements.
- Extended Temperature Grade: Rated for 0 °C to 100 °C operation, suitable for many industrial, communications, and data-center environments requiring extended ambient performance.
- RoHS Compliant: Meets RoHS requirements for environmentally conscious designs and global supply compliance.
Why Choose 10AX027H2F35E2LG?
The 10AX027H2F35E2LG provides a balanced combination of programmable logic, considerable embedded memory, and high I/O density in a single Arria 10 GX device package. Its series-level architecture emphasizes performance and power efficiency, making it suitable for mid-range systems where integration and flexibility matter.
This device is well suited for engineers and system architects building communication equipment, media processing platforms, and compute acceleration modules who need substantial on-chip resources, programmable DSP capabilities, and a proven Arria 10 feature set for scalable designs.
Request a quote or submit an inquiry to get pricing and availability for 10AX027H2F35E2LG and discuss how this Arria 10 GX FPGA can fit into your next design.

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