10AX032E2F27I2LG

The 10AX032E2F27I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) device built on a 20 nm architecture. It combines a high logic element count with embedded memory and advanced I/O to address performance- and power-sensitive midrange applications.

This device is suited for markets such as wireless, wireline, broadcast, computing and storage, medical, and military where a balance of throughput, power efficiency, and system integration is required.

Key Features

• Core Logic  320,000 logic elements provide high programmable logic density for complex FPGA designs.
• Embedded Memory  21,040,128 total RAM bits for on-chip buffering, caching, and data-path implementation.
• I/O and Connectivity  240 user I/Os plus support for low-power serial transceivers, PCIe Gen1/2/3 hard IP, and 10 Gbps Ethernet features described for the Arria 10 family.
• DSP and Processing  Variable-precision DSP block architecture (family-level feature) for high-performance signal processing workloads.
• Clocking and PLLs  Comprehensive clock networks with PLL clock sources and fractional synthesis capabilities for flexible timing and interface support.
• Power  Designed for power efficiency as part of the Arria 10 device family; supported device core voltage range is 870 mV to 980 mV.
• Package & Mounting  672-BBGA FCBGA package (supplier package 672-FBGA, FC 27×27) with surface-mount mounting for system integration.
• Temperature & Grade  Industrial-grade operation from -40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Implements channel processing and backhaul functions in remote radio heads and baseband subsystems using the device's DSP and high-speed I/O.
• High‑Speed Networking  Supports line-card and aggregation functions for 40G/100G systems leveraging on-chip transceiver and PCIe hard IP features.
• Broadcast and Video  Used in studio switching, video processing, and transport applications where integrated memory and DSP resources accelerate media paths.
• Computing & Storage  Accelerates server and cloud workloads such as caching and data-path offload with large embedded RAM and high logic density.

Unique Advantages

• High Logic Density: 320,000 logic elements enable complex system integration on a single FPGA, reducing external glue logic and BOM complexity.
• Substantial On‑Chip Memory: Over 21 million bits of embedded RAM support large buffers and high-throughput data pipelines without immediate external memory dependence.
• Flexible I/O and High‑Speed Interfaces: 240 I/Os combined with Arria 10 family transceiver and PCIe/Ethernet features enable versatile connectivity and protocol support.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in harsh or tightly controlled environments.
• Compact FCBGA Packaging: 672-BBGA (27×27) surface-mount package balances board-level density with thermal and routing considerations.
• Power‑Efficient 20 nm Architecture: Designed for improved performance-per-watt characteristics as part of the Arria 10 device family.

Why Choose 10AX032E2F27I2LG?

The 10AX032E2F27I2LG positions itself as a high-density, power-conscious midrange FPGA for designs that require substantial on-chip logic and memory along with flexible high-speed I/O. Its industrial temperature rating and compact FCBGA package make it suitable for embedded systems and networked equipment that demand reliability and integration.

For engineering teams targeting wireless infrastructure, networking, broadcast, or compute-acceleration applications, this Arria 10 GX device delivers a balanced platform for scaling performance while managing system power and board area.

Request a quote or submit an inquiry to get pricing and availability for the 10AX032E2F27I2LG and to discuss how it can fit into your next design.